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Rugged Mosfet
Audio Amplifier
Module
By LEO SIMPSON
Want a big powerful amplifier module based on
Mosfets? This one uses eight plastic Mosfets to
deliver just over 200 watts into an 8W load and a
whisker over 350 watts into a 4W load – just the
ticket for heavy duty amplification.
For many audio enthusiasts, Mosfets rule supreme and Hitachi Mosfets
are the best there are. But in the last
few years, Exicon, a manufacturer
from England, has appeared on the
scene with a range of plastic power
Mosfets. This new design features
these plastic devices which are
rated at 20 amps, 200V and 125W.
Eight of these devices – ie, four Exicon ECX10P20 p-channel and four
ECX10N20 n-channel – are used in
this amplifier module.
As the graphs of Fig.1 & Fig.2
demonstrate, the amplifier module
will deliver just over 200 watts into
an 8Ω load or just over 350 watts into
a 4Ω load, at the onset of clipping.
The onset of clipping is where the
harmonic distortion graph suddenly
becomes almost vertical.
While we’re talking about performance graphs, we might as well refer
30 Silicon Chip
to a few more. Fig.3 shows the frequency response which is 0.7dB down at
10Hz and 20kHz. While it is just off
the graph, the -3dB point is at 54kHz.
Fig.4 shows the harmonic distortion versus frequency for the power
amplifier module when delivering
250 watts into a 4Ω load. Fig.5 shows
harmonic distortion versus frequency
at 150 watts into an 8Ω load. As these
graphs show, the performance is quite
respectable.
The amplifier module is also very
quiet, which is as it should be for any
modern design. We measured a signalto-noise ratio of 117dB unweighted
(22Hz to 22kHz) and 123dB A-weight
ed with respect to full power into an
8Ω load.
The PC board is designed so that
the eight Mosfet power devices are
mounted onto a heatsink angle bracket
which then mounts on a large finned
heatsink as part of the amplifier chas
sis. Our photos show only the heatsink
bracket. The amplifier must not be
operated without a larger heatsink
as it will rapidly overheat.
Circuit description
Fig.6 shows the circuit diagram.
This amplifier is unlike most direct-coupled circuits in that it has
three differential stages to give it high
open-loop gain before negative feedback is applied.
Two BC546 NPN transistors, Q4 &
Q5, form the differential input stage
and their operating current is set by
the constant current source, Q7.
The signals at the collectors of Q4
and Q5 are then fed into the voltage
gain stage which comprises Q1, Q2,
Q3, Q6, Q8, Q9 and associated components. This can best be described
as a “double differential pair with
TO
N
I
W
200
S;
8-OHM TO
IN
350W MS
4-OH
current mirror load”. This stage works
as follows. PNP transistors Q2 and Q3
form the first differential pair with R8
as the common emitter resistor. The
output of Q2, Q3 provide differential
drive to NPN transistors Q6 & Q8. The
collector load for these two transistors
is provided by the current mirror transistors Q1 & Q9.
The current mirror ensures equal
current sharing in the associated differential pair and thereby provides
high gain and good linearity.
Finally, we come to the power output stage which is the business end
of the amplifier; it employs the eight
Mosfets mentioned earlier. These
are connected as complementary
source-followers which means that
they behave in a similar way to emitter
followers – their voltage gain is a little
less than unity but they have oodles
of current gain. In effect, the Mosfets
act as a buffer stage for the amplifier,
transforming the voltage drive from
the earlier stages to a low impedance
output which can deliver a great deal
of power – 350 watts in fact!
The signal at the collectors of Q8
and Q9 (ignore VR1 for the moment)
is applied to the gates of the paralleled
Mosfets, via the 390Ω resistors. As the
signal rises towards the positive rail,
the top Mosfets (10N20’s) start to conduct, allowing current to flow to the
load. Conversely when the signal goes
towards the negative rail, the bottom
Mosfets (10P20’s) conduct, pulling
current out of the load.
Performance
Output power ......................... 200 watts into 8Ω; 350 watts into 4Ω
Frequency response .............. -0.7dB down at 10Hz and 20kHz (see Fig.3)
Input sensitivity ...................... 1.7V RMS (for 200 watts into 8Ω)
Harmonic distortion ............... less than .01% (see Figs.1 & 2)
Signal to noise ratio ���������� 117dB unweighted (22Hz to 22kHz); 123dB
A-weighted with respect to full power into 8Ω
Stability .................................. unconditional
August 1996 31
LEVEL(W)
AUDIO PRECISION SCTHD-W THD+N(%) vs measured
10
29 MAY 96 14:55:34
1
AUDIO PRECISION SCTHD-W THD+N(%) vs measured
10
LEVEL(W)
29 MAY 96 14:58:49
1
0.1
0.1
0.010
0.010
0.001
0.001
.0005
.0005
0.5
1
10
100
300
0.5
1
10
100
500
Fig.1: total harmonic distortion versus power into an 8Ω
load. Power at the onset of clipping is 212W.
Fig.2: total harmonic distortion versus power into a 4Ω
load. Power at the onset of clipping is 353W.
AUDIO PRECISION SCFREQRE AMPL(dBr) vs FREQ(Hz)
5.0000
AUDIO PRECISION SCTHD-HZ THD+N(%) vs FREQ(Hz)
5
28 MAY 96 11:10:30
29 MAY 96 15:11:42
4.0000
1
3.0000
2.0000
1.0000
0.1
0.0
-1.000
0.010
-2.000
-3.000
-4.000
0.001
-5.000
.0005
10
100
1k
10k
50k
Fig.3: frequency response of the amplifier. While it is just
off the graph, the upper -3dB point is at 54kHz.
AUDIO PRECISION SCTHD-HZ THD+N(%) vs FREQ(Hz)
5
29 MAY 96 15:02:38
1
0.1
0.010
0.001
.0005
20
100
1k
10k
20k
Fig.5: total harmonic distortion versus frequency at 150W
into an 8Ω load.
The 390Ω gate resistors are there to act as “stoppers” for
the Mosfets. They act in conjunction with the high gate
32 Silicon Chip
20
100
1k
10k
20k
Fig.4: total harmonic distortion versus frequency for the
amplifier module when delivering 250W into a 4Ω load.
capacitance of the Mosfets to reduce their gain at very
high frequencies. This prevents the tendency of Mosfets
to “parasitic oscillation” which is typically manifested as
bursts of high frequency oscillation (typically at 10MHz
or higher) superimposed on the audio signal.
Sometimes parasitic oscillation in Mosfets can be at
such a high frequency that it will not be seen on typical
20MHz oscillo
scopes; 100MHz or higher bandwidth
scopes are necessary to show it.
However, even though it may be invisible on a typical
oscilloscope, it is most important to stop it happening
because paradoxically, even though it is at such a high
frequency, it will cause the harmonic distortion to be much
higher than it otherwise would be and the amplifier will
sound unpleasant as a result. Anyhow, that’s why the
stoppers are included.
Capacitors C16-C19 are included to match the input
capacitance of the n-channel devices to that of the p-channel types. This improves the gain linearity at high audio
frequencies.
The 0.22Ω 5W resistors in series with the source of each
Mosfet are there to provide a degree of local negative feed-
back and to help improve the current
sharing between devices.
Trimpot VR1 is connected between
the collectors of Q9 and Q8 and is there
is provide a voltage offset between the
gates of the n-channel devices at the
top and the p-channel devices below.
This voltage offset becomes a forward
bias which turns on the Mosfets slightly in the absence of any audio signal.
This quiescent (ie, no signal) bias is
necessary to operate the Mosfets in
the more linear region of their transfer curve and thus reduces crossover
distortion.
Zener diodes ZD1 & ZD2 and diodes
D3 & D4 protect the gates of the Mosfets
from overdrive. The zeners and diodes clamp the drive voltage between
gate and source of each Mosfet to a
maximum of about +12.7V. Since the
Mosfets act as source-followers you
might wonder how the gate voltage
could go this high.
Normally, the peak current (at full
power into a 4Ω load) would be no
more than about 3-4A. Since the
transconduct
ance of these Mosfets
is about 1 Siemen or 1V/A, then the
gate-source voltage can be expected
to rise to no more than about 4V or
so under normal drive. So how could
the gate voltage ever rise much above
this figure?
The answer is that the gate drive
becomes excessive when the load of
the amplifier is short-circuited and it
is being driven hard. Under these conditions, the gate voltage to the Mosfets
could easily rise above 20 volts.
However, the zener diodes do not
provide short-circuit protection to
the amplifier. That is provided solely
by the fuses. The Mosfets are rugged
enough to withstand short circuits
until the fuses blow.
Negative feedback is applied from
the output of the amplifier, via R21, a
22kΩ resistor, to the base of Q5, part
of the first differential pair. The AC
gain is set by the ratio of the 22kΩ and
1kΩ resistors at the base of Q5 and this
gives a value of 23. The resulting input
sensitivity of the amplifier is 1.7V RMS
for 200 watts into 8Ω and 1.6V RMS
for 350 watts into 4Ω.
The low frequency response of the
amplifier is set by two time-constants.
The first is made up of the 1µF input
capacitor C1 and the 47kΩ input bias
resistor R3, giving a -3dB point of
3.3Hz. The second time-constant is
provided by the 1kΩ feedback resistor
Fig.6: this power amplifier is unlike most direct-coupled circuits in that it has
three differential stages to give it high open-loop gain before negative feedback
is applied.
August 1996 33
hot. Choke L1 is wound with 20.5
turns of 0.8mm enamelled copper
wire onto a 14mm plastic former.
Once it is wound, scrape the enamel
off the wire ends and then tin them
with solder before installing the
choke on the board.
When installing the fuse clips, take
note of their little lugs which should be
on the outside ends of the fuse.
Heatsink bracket
Fig.7: this diagram shows a suggested power supply for the amplifier. The
power transformer is rated at 500VA.
R19 and the 100µF capacitor C8, giving a -3dB point of 1.6Hz. Combined,
they result in a response which is only
-0.7dB at 10Hz.
At the high frequency end, the
main determinant of the response is
the double time-constant provided by
the input network consisting of R4,
R5, C2 & C3 which produce a rolloff
above 80kHz. Other factors affecting
the high frequency response are the
10pF capacitor shunting the feedback
resistor R21 and the output coupling
network consisting of R30, R31, L1 &
C10. The latter network is included to
ensure stability of the amplifier under
reactive load conditions.
Power supply
And now a few words about the
power supply.
Ideally, you need a supply which
can deliver over 300 watts if you are
using an 8Ω load and almost 600 watts
if you are using a 4Ω load. A good
compromise is to use a 500VA transformer and six 10,000µF capacitors,
as shown in Fig.7.
Note that the DC supply rails are
±70V, a total of 140V between rails.
This is a potentially lethal voltage so
be very careful when making measurements around the circuit!
Construction
As supplied in the kit from Altron
ics, the PC board has a solder mask and
screen printed component overlay, to
make assembly straightforward. The
component overlay diagram is shown
in Fig.8.
Start construction by fitting the PC
pins and the resistors, then install the
diodes, capacitors and small signal
transistors. Watch the orientation of
the electrolytic capacitors, diodes and
transistors. Don’t confuse the 1N914s
and 12V zener diodes.
Mount the 5W resistors about 3mm
off the PC board, just in case they get
The next task is to assemble the
MJE340 and MJE350 transistors onto
the heatsink bracket. A total of six
transistors need to be mounted. If
you hold the bracket so that it’s facing
you, three MJE350s (Q2, Q3, Q1) are
mounted on the left, then the two
MJE340s (Q6, Q8) and then another
MJE350 (Q9). It is most important not
to mix them up.
We should also make a note about
the brand of MJE340s and 350s. As
we have stated in the past, Motorola
devices are the best. Other brands will
work but they are nowhere near as
good, giving rise to less power output
and higher distortion.
Fig.9 shows the details of how each
MJE340 and MJE350 is mounted to the
heatsink bracket. You can use mica
washers and heatsink compound for
each transistor or use silicone impregnated thermal washers. Do not
overtighten the mounting screws.
When all six TO-220 transistors
are mounted on the bracket, it can
be installed on the PC board and the
transistor leads soldered.
An easier method is used to secure
the power Mosfets to their heatsink
RESISTOR COLOUR CODES
❏
No.
❏ 1
❏ 2
❏ 4
❏ 1
❏ 1
❏ 2
❏ 2
❏ 8
❏ 2
❏ 1
❏ 4
❏ 1
❏ 1
❏ 1
34 Silicon Chip
Value
470kΩ
47kΩ
22kΩ
4.7kΩ
3.3kΩ
1kΩ
470Ω
390Ω
270Ω
150Ω
100Ω
10Ω
4.7Ω
1Ω
4-Band Code (5%)
yellow violet yellow gold
yellow violet orange gold
red red orange gold
yellow violet red gold
orange orange red gold
brown black red gold
yellow violet brown gold
orange white brown gold
red violet brown gold
brown green brown gold
brown black brown gold
brown black black gold
yellow violet gold gold
brown black gold gold
5-Band Code (1%)
yellow violet black orange brown
yellow violet black red brown
red red black red brown
yellow violet black brown brown
orange orange black brown brown
brown black black brown brown
yellow violet black black brown
orange white black black brown
red violet black black brown
brown green black black brown
brown black black black brown
brown black black gold brown
yellow violet black silver brown
brown black black silver brown
PARTS LIST
1 PC board, code PEDK5180,
205 x 97mm
4 3AG fuse clips
2 5A 3AG fuses
1 large heatsink bracket
1 large single sided heatsink
1 small heatsink bracket
8 TO-3P mica insulating washers
6 TO-220 mica insulating washers
4 transistor mounting clips
7 PC pins
1 plastic bobbin
1 1.2m length of 0.8mm enamelled copper wire
1 200Ω horizontal trimpot (VR1)
Semiconductors
4 ECX10N20 n-channel Mosfets
(Q12,Q13,Q14,Q15)
4 ECX10P20 p-channel Mosfets
(Q10,Q11,Q16,Q17)
4 MJE350 PNP driver transistors
(Q1-Q3,Q9)
2 MJE340 NPN driver transistors
(Q6,Q8)
3 BC546 NPN transistors
(Q4,Q5,Q7)
4 1N914, 1N4148 signal diodes
(D1-D4)
2 12V 400mV zener diodes
(ZD1,ZD2)
Capacitors
2 100µF 160VW electrolytic
1 100µF 25VW electrolytic
1 1µF 63VW electrolytic
1 0.22µF metallised polyester
2 .047µF monolithic
1 .001µF greencap
1 470pF disc ceramic
1 330pF disc ceramic
1 220pF disc ceramic
4 22pF disc ceramic
1 10pF disc ceramic
Fig.8: the parts overlay for the PC board. Note that the 5W resistors should
be spaced 3mm off the board. Take care to ensure that all polarised parts are
correctly oriented.
bracket. Spring clips are used to clamp
adjacent transistors. The screw which
retains the spring clip also secures the
heatsink bracket to the PC board. A
cross-section diagram of the mounting
is shown in Fig.10.
All eight Mosfets are soldered to the
PC board first, making sure that there
is about 8mm of lead length above the
board. This allows them to be bent over
without placing too much strain on
the leads. When the eight Mosfets are
soldered in place, the heatsink bracket
and spring clips can be assembled
together. Do not forget to use a mica
washer and heatsink compound for
each device.
Place a spring clip over two Mosfets
Resistors (0.25W, 5%)
1 470kΩ
8 390Ω
2 47kΩ
2 270Ω
4 22kΩ
1 150Ω
1 4.7kΩ
4 100Ω
1 3.3kΩ
1 10Ω
2 1kΩ
1 4.7Ω 1W
2 470Ω
1 1Ω 1W
8 0.22Ω 5W wirewound
4 zero-ohm links
2 100Ω 5W (for biasing setup)
Miscellaneous
Screws, nuts, washers, solder,
heatsink compound.
August 1996 35
and then, using a 4mm screw from under the board, secure it to the heatsink
bracket. The screw for each clip should
be fully tightened; the beauty of these
spring clips is that you cannot apply
too much force to the Mosfets.
Make sure that all devices are
insulated from the heatsink bracket.
Check that all six TO-220 devices are
insulated from their heatsink bracket
as well.
Now check over all your assembly
work, making sure that the component
installed in each position agrees with
that on Fig.8.
Setting up and testing
You will need a power supply (see
Fig.7), a multimeter and a small screwdriver to set up the module.
Remove the two fuses and solder a
100Ω 5W wirewound resistor across
each fuseholder. Rotate trimpot RV1
fully anticlockwise. This setting will
Fig.9: here’s how the six TO-220 transistors are
mounted on the heatsink bracket. You can use mica
washers and heatsink compound for each transistor
or silicone impregnated thermal washers.
36 Silicon Chip
result in the minimum quiescent current through the output stage. Connect
the ±70V supply rails and ground to
the board. Don’t connect a signal or a
load at this stage.
Set your multimeter to DC volts
and connect it across one of the 100Ω
resistors on the fuse clips. Now switch
on. No smoke? Good! If all is not well,
switch off immediately!
Assuming no smoke, measure the
voltage across the 100Ω fuse clip
Fig.10: this diagram shows the mounting details
for the power Mosfets. Spring clips are used to
clamp adjacent transistors.
Kit Availability
resistor. It should be quite low, about
1V or so. Now rotate trimpot RV1 anticlockwise until the meter reads about
7V. This means that the output state
quiescent current is 70 milliamps.
Now measure the voltage across the
other 100Ω fuse clip resistor; it should
be about the same. Next, measure the
voltage across the speaker outputs.
The voltage can positive or negative
but should be less than 50mV.
Let the amplifier run in this condition for 10 minutes or so, to let the
bias stabilise. Re-measure the voltage
across the 100Ω resistors and adjust
trimpot RV1 if necessary.
The next job is to fit the amplifier
with a suitable heatsink and mount it
inside a case with a cooling fan and
power supply. You can then connect
a loudspeaker and signal source and
listen to your heart’s content.
Troubleshooting
If the 100Ω resistors smoked when
power was applied, then check the
following:
(1). Bias pot turned wrong way (should
be anticlockwise).
(2). Power Mosfets transposed (N types
with P types).
(3). Power supply wrongly connected.
(4). Short on underside of PC board.
(5). Output device(s) shorted to heat
sink(s).
(6). Shorted capacitor on power
supply (check greencaps and electro
lytics).
If the current is unstable (ie, jumps
all over the place), or the sound us
crackly or hissy, then the amplifier
is possibly unstable. Check the following:
(1). Wrong values of resistors in the
signal section (check them all).
(2). Ceramic capacitors are incorrect
value.
(3). Earth or ground connection missing.
SC
(4). Mosfet shorted to heatsink.
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August 1996 37
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