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By NICHOLAS VINEN
Lots of new features in . . .
Altium
Designer 2013
PCB layout software
Altium Designer is the successor to the popular Autotrax and Protel
ECAD (Electronic Computer-Aided Design) programs but it has a lot
more features and capabilities than its predecessors. We take a look
at the latest version and detail some of its best features for circuit
design and PCB layout.
I
N THE NOVEMBER 2010 issue of
SILICON CHIP, we reviewed Altium
Designer Summer ’09, along with the
NanoBoard 3000 hardware. At the
time, we had had about a month to try
out Altium Designer but hadn’t done
a lot of serious work with it.
Since then, the software has gone
through a number of revisions and
we have used it extensively for PCB
layout. While it has a lot more capabilities than just PCB layout – including
circuit simulation and microcontroller/FPGA programming – we tend to
mostly use it for drawing up circuits
and subsequently laying out PCBs to
implement them.
We recently decided to take another
look at Altium Designer, for two reasons. Firstly, because a number of
new features and improvements have
been made in the last three years and
secondly, because we now have more
experience with Altium and this has
82 Silicon Chip
given us further insight into its particular strengths and weaknesses.
To recap briefly, for those who
are unfamiliar with Altium, it is a
high-end piece of electronics design
software which runs exclusively on
Windows computers and is used by
many businesses and individuals
to design products ranging from a
single component on a small board
up to monsters with thousands of
components and many layers. It is the
successor to Protel and inherits much
of its predecessor’s design philosophy
while adding a lot more.
New features
While there have been many updates to Altium Designer since we
originally looked at it, AD13 is the
first major update in a few years. It is
installed as a new piece of software,
rather than just updating the previous
version and it introduces a number
of new features. But upon investigation, we realised that most of the
improvements since AD09 have been
introduced incrementally over the
intervening time and these in total
have resulted in an overall substantial
improvement in Altium Designer.
One feature missing from Altium
Designer that has finally been added
in the latest update is layer transparency (see Fig.1). You can now set the
transparency for any visible layer as
a percentage, allowing layers beneath
to be seen through it rather than obscured by it.
This has a couple of important
benefits. Firstly, when doing tricky
routing jobs, it’s helpful to be able to
see all the layers at once so that you
can figure out whether a complex route
(possibly involving multiple vias and
tracks on many different layers) will
work or whether there are too many
obstacles in the way. Previously, this
siliconchip.com.au
required flipping between these layers
to make each in turn the top-most, so
you could see them in their entirety.
The transparency also allows you
to better see just how multiple track
segments in a single layer overlap.
This can be important since Altium
can automatically move and re-route
tracks but only as long as they are continuous and it’s quite easy to get into
a situation where two tracks appear
to be joined but there is a small gap
or overlap in the middle so they are
considered separate. With transparent
tracks, it’s easier to find such situations
and fix them.
Active Bill of Materials
This feature has just been introduced with AD version 13.3 and ties
in with the existing Vault and Bill of
Materials systems, which were already
quite powerful. Basically, what it lets
you do is shop for components for your
design from within Altium and then
associate a given component in your
design to the model and get supplier
information such as price and stock
as well as specifications, images, etc
(see Fig.2).
This can be used to fill in data on
Fig.1: close-up of
a mixed throughhole/surface mount
PCB design with
the new layer
transparency
feature enabled.
Tracks on all
layers can be seen,
through pads
or tracks on the
currently selected
layer.
the schematic, generate a total cost for
the project and ultimately produce a
list of parts to order.
The latest update also improves the
very useful PDF export feature, which
we’ll explain briefly below.
Other useful features
Over the years of using Altium Designer, we’ve found some things that it
is particularly good at doing. In many
cases, these features are not available
with other ECAD (Electronics Computer Aided Design) packages. Here is
a list of those we consider most useful,
in no particular order (we won’t go
into much detail on basic tasks such as
placing components – those are things
that just about any ECAD package can
do and haven’t changed much since
our last review):
• The ability to push tracks and vias,
during and after track routing: this
has come in very handy on a number
of occasions. Compare Figs.1 & 3. All
we did to change the PCB was click
on the lower via to the left of Q28
(labelled “PIN10”) and drag it up and
to the right. If there’s room, Altium will
then re-route tracks around it and even
push some aside (eg, the blue track
labelled “PIN2”) but only as much as
Fig.2: Active Bill of Materials links your design to part suppliers, giving access to real-time data on pricing and stock.
This data can then be used to generate an overall price for manufacturing the design, as well as making sure that all the
parts you need are available in sufficient quantities.
siliconchip.com.au
September 2013 83
Fig.3: the same
PCB as shown in
Fig.1 but here we
have dragged the
“PIN10” via up
and to the right.
Note how nearby
tracks have been
automatically
moved to make
room for it. Doing
this manually can
be time-consuming
on a large, complex
design.
necessary. We cleaned up the result
a bit to remove unnecessary wiggles
in the track but that was only a few
seconds of extra work.
You can do something similar with
tracks too; simply select one and then
drag it and it will move adjacent tracks
as it is dragged, if necessary. You can
even re-order tracks like this in some
cases, eg, when the other track emerges
from a via and the track you are dragging can go around either side.
Of course, you could do this all
manually but it would be quite a lot
of work; PCB layout is an iterative
process for all but the simplest designs
and when using other ECAD packages,
we’ve spent hours ripping up and relaying tracks before we found the best
routing solution. With Altium, this
same job can take minutes if you take
advantage of its ability to push and
re-route tracks for you.
Altium can also potentially move
tracks while you are placing a new
one, as long as you are using the
“HugNPush” mode. In this mode, as
you move the mouse alongside another track, it will place the new one
at a safe distance (ie, adhering to your
minimum clearance rules) but if you
try to move the new track through a
gap that is too small, Altium will move
tracks that are in the way (if possible)
to make room.
• Searching for items on the PCB
based on their characteristics and
doing mass changes. Again, this is
a real time-saver in some situations
compared to other packages which
require you to manually and laboriously change every single one.
For example, let’s say you design a
PCB to be manufactured in a particular factory then you move production
to another factory which has a larger
minimum via size. Your design may
have hundreds or even thousands of
vias. With Altium you can right-click
on one, select “Find Similar Objects”
and you are then presented with a
dialog which allows you to choose
which criteria to select – object type,
layer, hole size and so on.
Upon clicking “OK”, all matching
objects are selected. You can then use
the PCB Inspector (see Fig.4) to alter
their properties en masse. In this case,
you would simply type a new value
into the “Hole Size” input box and
press Enter and the hole size of all
selected vias would change to the new
value. You could also change the via
pad size at the same time, if necessary.
Any clearance violations which result
from this are then highlighted and you
can then fix them by, say, moving the
vias (Fig.5).
This same process can be used to
change text label fonts, line widths,
pad shapes – all manner of object
properties.
• TrueType fonts on PCBs: this is a
simple feature (to use, anyway) but
can make your PCBs look a lot more
classy. We still tend to use the default
vector font for component values and
so on as it keeps file sizes small and
it’s relatively easy to read. TrueType
fonts are great for labelling the board
with its product name, company logo
and so on, for a really professional
presentation.
• 3D view: not as pointless a feature
as it may at first seem. You need to
use components with 3D models (or
make your own) but once you do, all
Fig.4: a “zoomedout” view of the
same PCB as shown
in the earlier
figures with all
vias selected, using
the “Find Similar
Objects” dialog.
The properties of
the objects can then
all be changed at
once using the PCB
Inspector dialog,
shown here. In this
case, we can change
the via drill size,
copper diameter,
tenting (whether or
not they are covered
with solder mask),
net membership and
other properties.
84 Silicon Chip
siliconchip.com.au
Fig.5: after increasing
the hole size and
diameter for all vias,
some are now too
close to adjacent
tracks or pads so
these have been
highlighted in green.
This is the “online
design rule check”
feature in operation.
You can also get a
list of violations and
zoom in to see each
one in detail. Each
individual violation
can be fixed by
moving one or more
of the components
which are too close
together, as set by
your chosen design
rules.
you need to render your board in 3D
is a single key press. This can be used
to check component fit, especially
for those which have an overhang.
It can also be used to make sure that
the board and its components will fit
in a specific case, with the shafts and
LEDs lining up with the appropriate
holes and so on.
It’s also a great tool to show clients
what a design will look like before it
has actually been built. Compare the
3D rendering of our CLASSiC DAC
board (Fig.6) to the adjacent photo we
published from a similar angle. It’s a
pretty good match. Note that we built
all the 3D models ourselves, as we are
using a custom library. These are all
built from vertical extrusions, cylin-
ders and spheres. More advanced 3D
models are possible if you have access
to 3D “STEP” models (Standard for
the Exchange of Product model data).
• Complex design rules: design rules
(minimum clearance, minimum track
width, minimum hole size, etc) can
depend on object attributes such as net
membership. For example, say you are
laying out a PCB with high-voltage and
low-voltage sections. You need different track clearance rules depending on
whether the two tracks in proximity
are low-voltage, high-voltage or one
of each.
In many PCB layout programs, you
have to check this manually, eg, set
the track clearance to the minimum
for the low-voltage section and then
check each high-voltage track in turn
to ensure it is far enough away from
any low-voltage tracks. But in Altium
you can set up multiple rules so that
this happens automatically and you
will be alerted if any given pair of
tracks are too close for safety.
For those who aren’t familiar with
the terminology, we should point out
that a “net” is a collection of component pins and tracks which are electrically connected. An Altium schematic
drawing can be used to automatically
generate a list of nets (“netlist”) and
this is brought into the PCB layout,
both to act as a guide during layout
and in order to perform the Design
Rule Check (DRC) which alerts you to
short circuits between nets, nets which
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September 2013 85
Fig.6: a 3D view of our CLASSiC DAC design, using simple 3D models we built ourself using the 3D tools Altium provides.
These are vertical shape extrusions, cylinders and spheres. As you can see, despite the simplicity of this approach, the
result looks quite realistic and can be used both to visualise the design and to check the mechanical fit of components and
overall assemblies before a prototype is built.
are too close to each other (clearance
violations) and so on.
We used net-specific clearance
rules to help lay out the Soft Starter
for Power Tools PCB (published in
July 2012). Once the net classes and
design rules are defined, you can lay
tracks in the low voltage section and
they will automatically stay away from
the high-voltage tracks.
Fig.7 shows an extra track added to
this design, between the low-voltage
section at right and the incoming
mains Active track at left. Note that it is
flagged as violating the clearance rules
with the Active track even though it is
further away from this than it is from
the low-voltage ground track at right.
In fact, Altium has a very powerful
design rule system which allows you
to set up many different custom rules
depending on requirements, eg, some
areas of the PCB can have different
track clearance or width rules and
so on. Design rules are assigned an
order of priority so that you can set up
exceptions to rules and you can even
have rules which are based on boolean
expressions. It’s a powerful system.
• Ability to “tent” individual pads/
vias, change individual hole sizes,
86 Silicon Chip
pad sizes, shapes and component outlines: normally, you define component
characteristics in your PCB library and
them simply place them on a board.
But there are many times when a component on the PCB must vary from the
default. For example, you may need
to make the pads of a particular component thinner to make enough room
for a track to pass through the middle
while in other cases, you want them to
remain larger to minimise the chance
of tracks being lifted during soldering.
With some PCB layout programs, in
this situation you are forced to create
a new library element with a different pad arrangement and you quickly
end up with many variations of each
component to suit different situations – it’s messy. With Altium, you
can simply edit the component on the
PCB by “unlocking” it and then making changes. You can re-lock it when
you are finished.
This isn’t without its drawbacks –
for example, if you later change the
base component in the library and
then update the PCB with this new
configuration, any changes to components which have been varied are lost
and must be re-applied. So this is a
feature to be used with caution but it
can still be a real time-saver.
We also like the fact that we can
selectively “tent” vias and pads on
either or both sides of the PCB, so that
they are covered with solder mask
during the manufacturing process.
Some layout programs force you to do
all-or-nothing tenting and by making
this part of the manufacturing export
step, you can easily forget to do it, eg,
when re-ordering a board you have
had made previously.
• Interactive routing: while other
PCB layout packages have interactive routing, Altium’s version works
particularly well. We described the
most useful modes, “Walkaround”
and “HugNPush”, in our last review.
One useful feature we didn’t ment
ion is the ability to press the backspace
key while laying a multi-segment track
to go back a step if the last segment
didn’t get placed quite where you
wanted it to. It’s also quite easy to
move track segments after laying them
without having to re-do the connecting
segments.
Also, because Altium picks up the
initial track size from the pad/track
which you click on to start placing, you
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This is the fully-assembled
CLASSiC DAC PCB. It clearly
demonstrates the realistic
appearance of the Altium 3D
model.
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This may seem like a small point but it
saves a lot of fiddling and frustration.
Also, when a new component or
via is placed, if it is in contact with
an existing track, it is automatically
added to the same net. You have to
be careful since that may not always
be what you want but it’s very handy
for example when placing vias on a
ground or power plane – although
there is also an automatic via stitching feature which can do this for you.
• Polygon pours: while this is a common feature of PCB layout programs,
Altium’s handling of it works particularly well. For a start, after placing a polygon, you can easily move
its corners and edges, add vertices
and so on. It’s also easy to re-pour a
polygon (around tracks, pads and other
polygons) and to “shelve” it, which
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Fig.7: Altium’s powerful Design Rule Checking system has several benefits for
PCB design and layout. This demonstration shows how tracks assigned to nets
in various “net classes” can have different clearance rules. The track at left
carries 230VAC mains voltage (≥100 thou clearance) while the track at right
is low voltage (≥20 thou clearance) and hence the added track in the middle
causes a rule violation for one but not the other.
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September 2013 87
How Multi-Layer PCBs
Are Designed & Made
I
N THIS ARTICLE, we have referred to
“tented vias” and “polygon pours” but readers may not be familiar with these terms.
Making double-sided and multi-layer PCBs is
quite complex so we won’t give the full details
here but the following information should go
some way towards explaining these terms.
As with a single-sided PCB, double-sided
PCBs are generally made using a sheet of
fibreglass as a substrate but with copper
foil laminated on both sides and then etched.
The problem is how to connect the tracks on
the top of the board to those on the bottom.
The simplest method is to drill a hole through
both and then solder a wire or component
lead on both sides. But this is virtually impossible for components that sit right on the PCB
surface and soldering feed-through wires is
expensive and time-consuming.
Vias
Vias are used to perform the same function. To create a via, a hole must still be
drilled but it can be quite small; they are typically around 20 thou or 0.5mm in diameter
although larger/multiple vias are used for
high-current tracks. Copper is then plated
onto the cylindrical fibreglass surface of the
hole, forming a hollow wire which joins the
two tracks.
In fact, a modern double-sided board will
have all or most of the holes plated, including
those for component leads. This means that
component leads are held into their mounting
holes more strongly than they would be if
temporarily removes it from the design
as this makes it easier to edit tracks
which intersect with it.
You can define the polygon pour
order which is important for deterministic results when polygons overlap.
You can also determine whether copper is poured directly into contact with
pads or if they are instead connected
with (thermal) “reliefs” which are
basically short sections of track. This
is important to avoid dry joints for
components connected to large copper
planes which can otherwise act as a
heatsink during soldering.
The polygon-pad connection style
can be defined on a per-PCB or per88 Silicon Chip
they were just soldered to the copper tracks,
even if soldered on both sides. It’s also easier
to just plate all the holes although exceptions
can be made if necessary.
Most modern PCBs also have a “solder
mask” layer applied as one of the final steps.
This is a polymer film which covers the
copper tracks but leaves the pads exposed,
making accidental track-to-track, track-topad or pad-to-pad bridges much less likely
when soldering. It also greatly reduces the
amount of solder required when using wave
soldering and helps improve the reliability of
reflow soldering.
Since the holes drilled in a PCB aren’t necessarily perfectly aligned with the tracks, vias
require a certain amount of copper around
them on both sides to make sure the hole is
touching copper and thus the through-plating
makes the required connection. But it isn’t
necessary to solder anything to these vias
and often they are placed under components,
making it impossible.
So it’s common to have the solder mask
completely cover a via. This is known as
“tenting”. Through-hole pads may also be
tented on one side of the board, which we
find helps with soldering (less solder wickthrough).
with just the two layers becomes excessive.
ICs in packages with very closely spaced pins
or lands (ie, those in BGA or LGA packages)
generally require at least four layers to “break
out” all the connections from the IC to tracks
leading away from it.
Multi-layer boards are fabricated as multiple thin double-sided boards which are then
laminated together. Clearly, alignment in this
process is very important. Additional steps
are required to allow vias to pass through
multiple layers.
The simplest form of via on a multi-layer
board is one which goes all the way from
the top layer to the bottom layer, joining
all the layers between. However it is also
possible to have a “blind via”, which starts
at either the top or bottom layer but terminates at some intermediate layer, leaving the
remaining copper layers above or below it
electrically isolated. Similarly, it is possible
to have “buried vias” which are only between
two or more internal layers and not visible
from the outside at all, once the PCB has
been completed.
Altium has comprehensive support for
multi-layer boards and allows each via to
have a unique profile, connecting to some
or all of the layers with different-sized pads
on each layer if necessary.
Polygon pours & thermal reliefs
Sometimes, having just two layers isn’t
enough; vias take up space on the board and
at some point a design becomes so complex
that the number of vias required to lay it out
The copper tracks used to join components are usually formed from line segments; curves are also possible and for
radio-frequency signals may be required. But
sometimes you need to join many pads and
vias together and the easiest way is to do a
“flood fill”, where all the otherwise unoccupied areas on a particular layer are filled with
a continuous island of copper and this island
is then connected to each point as required.
polygon basis, which is useful because
for high-power tracks you may need
the direct connection whereas components connected to a signal ground
plane can do so via reliefs. You also
get several options for each polygon
pour, for example, whether to remove
“dead” copper, ie, copper islands with
no actual electrical connection.
• Net & layer highlighting: when you
move a mouse over a track or pad in
Altium, the connected net is automatically highlighted. But more importantly, you can hold down Control and
click a net and the rest will dim. These
two effects can be used in combination to see where various tracks cross
over on different layers and so on.
A feature we find even more useful –
even vital in some cases – is the ability to view and edit a single layer of a
PCB at one time which is accessed via
the Shift + S keyboard shortcut. This
is a great way to remove the clutter
from the display when working on a
complex layout and it’s also incredibly
useful when you are trying to select a
group of tracks but not the components
or other objects that connect to them.
One could get a similar effect by
manually disabling all but one layer
and then re-enabling them later but
that would be a lot of work. With this
shortcut, you can easily flip between
Multi-layer boards
siliconchip.com.au
This is a common way to make ground
connections but can also be used for power
distribution on multi-layer boards. On a
four-layer board, it may be the case that one
layer is used for ground (bottom, say), one
for power (top) and two for signal routing.
This means that wherever ground or power
is required – and for some designs, that may
be at hundreds of different points – you just
need to place a via at that point from the
appropriate power plane layer.
Any through-hole pads must be on the top
or bottom layer, to allow components to be
soldered to it after the PCB has been made,
so in this case you need a “hole” in the power
or ground plane so it isn’t shorted to one of
those. Most PCB layout programs therefore
provide an automated polygon pour feature.
You specify a layer and an outline (which
may be the whole PCB or a section of the
PCB) and assign it to a particular net. Within
that outline, all blank spaces (or depending
on settings, contiguous blank spaces) are
filled with copper, with an appropriate clearance to all adjacent tracks and pads. Tracks
or pads within this area that are assigned to
the same net are joined to or merged with
this copper fill.
Fig.9 on the following page shows a
portion of the CLASSiC DAC PCB which has
ground planes on both the top and bottom
layers formed by “polygon pours”. As you
can see, it is automatically poured around
the vias that are under IC5. Also note the “via
stitching” joining the two ground layers for
a low impedance at upper left.
Thermal reliefs
The vias between the top and bottom
ground planes in Fig.9 use the “direct connect” style where a hole is simply drilled
through the two planes and plated though,
top and bottom layers (or on a multilayer board, inner layers) to follow
what is going on.
• Layer sets: a quick and easy way
of showing or hiding groups of layers
at once. For example, you can have
a minimal layer set (top and bottom
copper plus pads, say) and a more
complete layer set for when you need
to see everything (including mechanical layers) and quickly switch to the
minimal layer set while doing routing.
• PDF export: this is a great way
to show schematics to co-workers
or create documentation for clients.
Larger designs will normally take up
multiple schematic sheets and these
siliconchip.com.au
giving the lowest possible resistance for the
connection.
However, the pads joining to this ground
plane (ie, the pin of each component that’s
connected to ground) are joined using “thermal reliefs”. This is true for both through-hole
and SMD components. For example, look
at the two capacitors to the left of IC5. The
left-most pad of each is isolated from the
ground plane by a narrow ring where the
copper has been etched away, except in four
places, 90° apart.
The idea here is that the electrical resistance of the connection is still very low
because although the sections joining the
pad to the ground plane may be narrow,
they are also very short. This usefully raises
the thermal resistance between the pad and
ground plane. The ground plane, being a large
sheet of copper foil, has a fairly low thermal
resistance to the ambient air surrounding
the board.
As a result, trying to solder any components directly to the ground plane is going
to be more difficult as it will draw heat away
from the joint. Molten solder applied to the
PCB that is hot enough to solder a component
joined to a thin track (eg, during wave soldering) may solidify on a ground-connected
pad before a proper joint has been formed.
But the relief-connected pads have an intermediate thermal resistance to ambient, ie,
lower than other pads but not much lower
and so only a small amount of extra heat is
required when soldering.
The thermal reliefs may seem too small
to make a noticeable difference but if you
try soldering to pads with both connection
styles you will find that the difference is quite
significant. And when using automated assembly techniques, relief connections may
be required to get consistent results.
can be exported in a single action to
a multi-page PDF. With the latest version of Altium, you can even click on
components in the PDF schematic to
see the component attributes (type,
voltage, power rating, tolerance etc).
You can also export the PCB to a PDF
but this is less useful for a variety of
reasons, including low contrast with
red/blue on white (for some reason it’s
much easier to see on black). We prefer
exporting PCBs to Gerber files, which
can also be sent off for manufacture.
Advanced features
Altium also has a number of features
which we do use but rarely. Many
of these are important for designing
commercial equipment, especially
high-speed digital circuits. For example, when laying out boards with
fast memory (eg, DDR) or high-speed
buses, you want to keep each track in
the bus to much the same length, so
that the signals arrive at the other end
simultaneously.
Altium provides a few ways of doing this which really make it easy. In a
recent design, we used the Interactive
Length Tuning feature to lengthen individual tracks in a bus until they were
all the same (Fig.8). With this tool, all
you do is set up the parameters and
“wipe over” a track and zig-zags are
automatically added until its length
has increased to the set maximum.
A similar effect can be achieved
using the “Equalise Net Lengths”
menu option. There’s also an option
for tuning differential pairs, which
are normally routed together but may
need to be modified to have the same
length, depending on the details of the
route. Once you’ve finished routing
tracks, you can then use the Signal
Integrity checker (also visible in Fig.9)
to check that all the tracks meet your
various requirements for overshoot,
undershoot and so on.
Potential improvements
With such a large piece of software,
it’s inevitable that there would be
some things we don’t like. And while
there are a few, generally they are
more minor annoyances than serious
problems. Probably the most obvious
limitation is that you need to keep your
computer hardware up to date to get
decent performance.
Having said that, fast computers are
really quite cheap these days and the
hardware cost is a pretty insignificant
cost of running the software – the license itself being far more expensive.
Altium’s disk footprint has been somewhat reduced by recent updates, from
multiple gigabytes down to about 1GB
if you are mainly doing PCB layout
work, which shows that they have a
desire to optimise the software rather
than just adding more “bloat”.
We do occasionally run into bugs
but generally these do not result in any
lost work – Altium has a pretty good
system for automatically handling
“exceptions” gracefully. But on occasion, it can go into an endless loop
and it has to be terminated. Normally
though, this only happens when using
September 2013 89
Fig.8: Altium
has a number of
advanced design
features for
modern, highspeed digital/
analog PCB
designs. Here we
are showing two –
Interactive Length
Tuning (to add the
“wiggles” to the
tracks in the bus at
left) and the Signal
Integrity dialog
which performs
analysis of the
design to ensure
it meets design
specifications.
one of the newer features; the basic
PCB layout portion of the software
itself is quite reliable.
We have also run into some fussiness importing and exporting certain
types of file, such as old Protel PCB
files and Gerber files. PCB files generally import correctly except that
sometimes text is misplaced or rotated.
PCB files are sometimes not exported
correctly though – for example, if you
export a PCB with a polygon fill to a
format that doesn’t support polygons,
they are silently dropped from the
design. We should probably consider
ourselves lucky that Altium still supports such an ancient file format at
all – in a similar situation, many other
vendors would forget it entirely.
As for Gerber files, the format is
notoriously poorly standardised so it
isn’t surprising that we have to fiddle
with the file headers to get Altium to
successfully import a file produced
in another ECAD package. With a
modified header, it processes the file
correctly.
Some areas of the user interface
which we previously would have
criticised have been improved with
updates over the last few months. It’s
somewhat unusual when a software
company brings out frequent updates
to their product and they actually
make it noticeably better! For example,
certain menus which appear during
PCB editing now pop up more quickly,
resulting in a smoother work flow.
Conclusion
Fig.9: close-up of a PCB design (the CLASSiC DAC) showing copper ground
planes on both top and bottom layers made using polygon pours. Note how the
“poured” copper “flows” around vias, tracks and any other areas of copper that
belong to different nets. Component pads joined to the ground plane are via
“thermal reliefs” while vias are joined directly to both planes.
90 Silicon Chip
Altium Designer is a very powerful tool for PCB layout, especially for
demanding designs. That comes at a
price though: $A7245 + GST initially
and $A1750 + GST per year for updates after the first year. That’s not an
unreasonable amount to pay for such
a powerful tool if it’s used every day
in a commercial environment but it’s
certainly out of the reach of amateurs;
there is a (much cheaper) student version though.
We would certainly recommend
Altium as a circuit and PCB design
and layout tool, if you can afford it. It
has so many useful features that users
will need to attend some of their training seminars before they will have a
chance to use its full potential.
For further information, contact
Altium on +61 2 9410 1005 or email
SC
sales.au<at>altium.com
siliconchip.com.au
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