This is only a preview of the September 2014 issue of Silicon Chip. You can view 35 of the 104 pages in the full issue, including the advertisments. For full access, purchase the issue for $10.00 or subscribe for access to the latest issues. Items relevant to "Create Eerie Music With The Opto-Theremin, Pt.1":
Items relevant to "A Wideband Active Differential Oscilloscope Probe":
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Mini-D Stereo
10W/Channel
Class-D Audio
Amplifier
This little chip can deliver
a whopping 30 watts! With
no heatsink!
Main Features
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Stereo or mono Class-D amplifier
on a single, small PCB
No heatsink required
Low EMI
DC power supply, wide operating
voltage range
Drives one or two 4-8Ω speakers
Selectable gain
On-board volume control
RCA input sockets
Shutdown mode
Output short-circuit protection
DC offset protection
Over-temperature shutdown with
auto resume
Selectable output power limit with
soft clipping
Low quiescent current
Reversed supply polarity protection
Input signal overload protection
Power and fault indicator LEDs
Under-voltage and over-voltage
lock-out
74 Silicon Chip
This tiny Class-D amplifier module can
work in two modes. In stereo it can deliver
more than 10W per channel or you can
connect its output channels in parallel
to deliver more than 25W into a single
speaker. It is up to 91% efficient, with
selectable gain, volume control and other
features such as a low-power shutdown
mode and over-temperature, over-current,
short circuit and speaker protection.
By NICHOLAS VINEN
H
OW CAN A CHIP this small deliver so much power? And how can it
deliver so much power without needing a big heatsink? The answer to both
questions is Class-D operation. It’s a
switching amplifier and its efficiency
can be over 90%. High efficiency is
also good if you want to run it from a
battery since it will last longer. And if
running from mains, you don’t need
a bulky power supply; a 1A plugpack
should be more than adequate.
We published our first switching
amplifier design, the CLASSiC-D,
in November & December 2012. It’s
a powerful beast, able to deliver up
to 250W into a 4-ohm load or 500W
into an 8-ohm load (bridged) with low
distortion. Lots have been built since
its publication.
But while you may want the high
efficiency of Class-D, the CLASSiC-D is
simply too big and expensive for many
applications where you only need a
few watts of audio, perhaps running
off a small battery – for busking, for
siliconchip.com.au
GVDD
PVCCL
BSPL
PVCCL
PBTL Select
OUTPL FB
Gate
Drive
OUTPL
OUTPL FB
LINP
Gain
Control
PGND
PWM
Logic
PLIMIT
GVDD
LINN
PVCCL
BSNL
PVCCL
OUTNL FB
OUTNL FB
FAULT
Gate
Drive
OUTNL
SD
GAIN0
TTL
Buffer
SC Detect
Gain
Control
GAIN1
PLIMIT
Reference
PLIMIT
Ramp
Generator
Biases and
References
Startup Protection
Logic
AVDD
AVCC
PGND
DC Detect
Thermal
Detect
GVDD
PVCCL
BSNR
UVLO/OVLO
LDO
Regulator
PVCCL
GVDD
Gate
Drive
GVDD
OUTNR
OUTNN FB
OUTNR FB
RINN
Gain
Control
PLIMIT
PGND
PWM
Logic
GVDD
RINP
PVCCL
BSPR
OUTNP FB
PVCCL
Gate
Drive
PBTL
TTL
Buffer
OUTPR
PBTL Select
OUTPR FB
AGND
PGND
Fig.1: block diagram of the TPA3113D2 Class-D audio amplifier IC. The left & right channel differential inputs are
buffered and fed to Schmitt trigger stages where they are compared against a ramp (triangle) signal. The resulting
PWM signals are then fed to PWM logic blocks which then drive two bridge-mode stereo switching amplifiers.
example. Or say you want to build a
pair of self-powered computer speakers. Whatever the reason, a few watts
can go a long way.
That’s where Mini-D amplifier
module comes into its own. It’s based
on the Texas Instruments TPA3113D2
which contains two complete bridgemode stereo switching amplifiers. It’s
so efficient that it doesn’t need a heatsink for normal program material; the
PCB itself dissipates the heat.
Only a simple output filter is required to minimise the amount of RF
interference generated by its switchmode operation. This consists of just
four ferrite beads and four ceramic
capacitors, or eight components for
the two channels. All the components
are surface-mount types, selected
so that they are straightforward to
solder.
Because the Mini-D module’s outputs are bridged, it has good power
delivery even with moderate supply
siliconchip.com.au
rails. With a 12V supply, it can deliver
at least 5W per channel into 8-ohm
speakers or 2 x 10W into 4-ohm loads.
More power is available with higher
supply voltages.
Unusually, the Mini-D can also operate in mono mode, with the outputs
paralleled. This doubles its current
capability, allowing more power into
low-impedance loads, eg, 25W or more
into 4Ω.
By the way, we’ve said this in the
past but it bears repeating: while the
output transistors in Class-D amplifiers spend most of their time either
on or off, they aren’t really ‘digital’
amplifiers. While there may be some
digital circuitry involved, they still
work on the principle of analog negative feedback to generate the correct
output waveform for a given input
signal.
Class-D amplifier operation
We won’t go into the full theory of
how a Class-D amplifier works but let’s
look at the functional block diagram
of the TPA3113D2 IC (Fig.1) which is
the heart of the circuit.
The two inputs are differential.
Looking at the left channel, the signals
are fed to LINP (in-phase) and LINN
(ground/out-of-phase) at top left. The
feedbacks from the switching outputs,
OUTPL FB (positive) and OUTNL
FB (negative), pass through low-pass
RC filters internal to the IC and these
four signals all go into a differential
amplifier which performs this analog
computation:
(LINP - LINN) x GAIN - (OUTPL - OUTNL)
The GAIN setting is determined by
the state of two digital inputs, GAIN0
and GAIN1, which control the resistances in this part of the circuit to select
an effective gain of 20dB, 26dB, 32dB
or 36dB. The output of this differential
amplifier then passes through another
RC low-pass filter, to further attenuate
September 2014 75
Parts List
1 double-sided PCB, code
01110141, 46 x 85mm
4 HI1812V101R-10 ferrite beads,
SMD 4532/1812 (FB1-FB4)
(element14 2292377)
2 PCB-mount switched RCA
sockets, white & red (CON1CON2) OR
2 2-way pin headers plus shielded
cable, header plugs and
chassis-mount RCA sockets
3 2-way mini terminal blocks,
5.08mm spacing (CON3-CON5)
1 3-way pin header, 2.54mm pitch
(CON6)
3 shorting blocks
1 10kΩ dual gang 9mm log
potentiometer (VR1) OR
2 10kΩ mini horizontal trimpots
(VR2-VR3) OR
1 20mm length tinned copper wire
or two component lead off-cuts
3 2-way pin headers, 2.54mm pitch
(LK4-LK6)
3 tapped spacers with M3 x 6mm
machine screws (optional, for
mounting)
Semiconductors
1 TPA3113D2PWP Class-D Audio
Amplifier IC, HTSSOP-28
(element14 1762987)
1 IRFML8244 N-channel Mosfet,
SOT-23 (Q1) (element14
1857298)
1 BSS84 P-channel Mosfet, SOT23 (Q2) (element14 1431318)
the switching artefacts in the signals,
and then into a differential buffer.
During normal operation, with the
output correctly tracking the input
(after gain is taken into consideration),
the output of these amplifiers will be
virtually nil, ie, the two differential
lines will be at the same potential.
Any deviation from this state means
that the amplifier output must swing
one way or the other.
The buffered signal passes through
the PLIMIT block which allows an
external voltage to limit the maximum
output swing, for speaker overload
protection. The signals then pass into
a pair of Schmitt-trigger comparators
where they are compared against a
ramp (triangle) signal, generated by
an internal oscillator.
This is a common method for pro76 Silicon Chip
5 5.6V zener diodes, SOT-23 (ZD1ZD5) (element14 1431238)
2 BAT54A dual Schottky diodes,
SOT-23 (D1,D2) (element14
2114869)
1 high-brightness green LED, SMD
3216/1206 (LED1) (element14
2217905)*
1 high-brightness red LED, SMD
3216/1206 (LED2) (element14
1226389)*
Capacitors (all SMD 3216/1206**
unless stated)
2 100µF 25V low-ESR radial
electrolytics
7 4.7µF 25V X7R ceramic
(element14 1828835)
6 220nF 50V X7R ceramic
(element14 1327724)
8 1nF 50V NP0/C0G ceramic
(element14 2280692)
4 330pF 50V NP0/C0G ceramic
(element14 3606090)
Resistors (all SMD 3216/1206** 1%)
9 100kΩ (element14 1811974)
2 10kΩ (element14 1811973)
2 100Ω (element14 1632521)
5 10Ω (element14 1591420)
2 4.7Ω (element14 2142059)
2 0Ω (element14 1632520) (LK1-3)
* or use 2 x 2-pin headers with offboard LEDs
** SMD 2012/0805 size parts can
also be used
ducing PWM (pulse width modulation), typically used in motor control
circuits. The main difference here is
that the operating frequency is much
higher; around 310kHz. This is necessary to allow accurate reproduction of
audio signals up to 20kHz.
PWM output
These signals then pass through the
PWM logic to the Mosfet gate drivers
and then the totem-pole output stages,
consisting of N-channel Mosfet pairs.
This chip uses a ‘centre-aligned’ or
‘dual-ramp’ PWM, a different modulation scheme to that used in many
other Class-D amplifiers. This is shown
in Fig.2 and is possible because the
TPA3113D2 always operates in bridged
mode. In the quiescent condition, both
outputs are driven in-phase with a 50%
duty cycle (top of Fig.2) and this results
in no current flowing in the speaker(s)
or filter at all.
To drive the output positive, the
duty cycle of the positive output is
increased while the negative output duty cycle decreases (middle of
Fig.2). This is done by shifting both
the leading and trailing edges of both
waveforms. Since none of these edges
line up, this spreads RF emissions out,
making them easier to filter. To drive
the output negative, the reverse condition occurs (bottom of Fig.2).
Since the output transistors are Nchannel Mosfets, a supply above the
positive rail is required for the upper
gate drive. This is generated by four
220nF capacitors between the OUTPL
& BSPL terminals, OUTNL & BSNL etc.
When the respective output is low, its
capacitor charges through an internal
diode from GVDD (~7V) and when the
output goes high, the capacitor charge
maintains the associated boost pin 7V
above that output, sufficient to keep
the upper Mosfet conducting.
The block diagram also shows the
protection circuitry, including shortcircuit detection, output DC offset
detection, high temperature detection and under/over-voltage lock-out.
Should any of these fault conditions
occur, the output drivers are all
switched off. The over-temperature
cut-out kicks in when the die temperature hits 150°C and operation resumes
once it has dropped by around 15°C.
When the chip is running in mono
mode, as set by the PBTL input pin, the
PWM logic is modified slightly so that
OUTPL and OUTNL carry an identical
signal. At the same time, OUTPR and
OUTNR are both driven with the same
out-of-phase PWM signal, allowing the
pairs of outputs to be paralleled.
Speaker wires
Because ‘centre-aligned’ PWM is
used in this chip, only a very simple
output filter is required to minimise
the amount of RF interference generated. This consists of just four ferrite
beads and four ceramic capacitors. The
data sheet states that the ferrite bead
output filter is sufficient for twisted
speaker wires up to 1.2m long. We
imagine that standard figure-8 speaker
wires should also be OK, given that
the conductors are in close proximity.
If you want to use longer speaker
leads or are particularly concerned
about radio interference, you can add
siliconchip.com.au
No output (quiescent)
33µH
OUTP
OUTP
L1
OUTN
33µH
OUTP-OUTN
Speaker
Current
C1
1µF
OUTN
L2
0V
Positive Output
OUTP
C2
1µF
Cutoff Frequency = 27kHz, Speaker Impedance = 8Ω
OUTN
15µH
OUTP
OUTP-OUTN
Speaker
Current
L1
C1
2.2µF
0V
15µH
Negative Output
OUTN
OUTP
L2
C2
2.2µF
OUTN
Cutoff Frequency = 27kHz, Speaker Impedance = 4Ω
OUTP-OUTN
Speaker
Current
0V
Fig.2: the quiescent (top), positive output (middle) and
negative output (bottom) signal waveforms for the TPA
3113D2 Class-D audio amplifier IC.
an external LC output filter. This could
be wired externally to the board, ie,
between the output terminals and
speakers. Note that you would need to
keep the components relatively close
and run some connections to a PCB
ground point.
One disadvantage of this approach
is that the filter component values
must be selected based on the speaker
impedance. Also, the inductors must
handle the peak load current (up to
4A in some cases) without saturating.
The recommended filters for 8-ohm
and 4-ohm loads are shown in Fig.3.
Note that an LC filter may also give
improved efficiency.
Speaker impedance
For supply voltages up to 15V, the
unit can drive speakers with nominal
impedances from 4-8Ω. Above 15V,
however, it isn’t recommended to
drive 4Ω speakers. Plenty of power for
4Ω loads is already available at supply
voltages below 15V anyway.
To drive 4Ω speakers from a supply above 15V, it’s necessary to run
the Mini-D in mono mode; more on
that later. To drive two speakers in
this mode, you will need to build two
boards but in exchange for that, you
siliconchip.com.au
Fig.3: an external LC filter can be added if long speaker
leads are to be used, with the filter component values
selected according to the speaker impedance. These two
diagrams show the recommended values for 8-ohm and
4-ohm loads.
get more power and higher efficiency.
Circuit description
The full circuit is shown in Fig.4.
All the real work is done by IC1. The
left & right channel input signals are
applied to RCA connectors CON1 and
CON2. Alternatively, pin headers may
be fitted in their place for connection
to chassis sockets or another board.
From this point on, we shall refer to
the operation of one channel only.
The signal first passes through a
low-pass RF-rejecting filter, comprising a 100Ω series resistor and 1nF
ceramic capacitor. Both the signal
and ground pins are then AC-coupled
to the volume control potentiometer
(VR1) via 4.7µF ceramic capacitors.
The signal ground is also connected to
power supply ground via a 4.7Ω resistor, taking advantage of the differential
inputs provided by the IC.
This 4.7Ω resistor reduces the
chance of hum being injected into
the signal due to the common input
grounds.
The volume control potentiometer is
either a dual-gang log pot (VR1) or two
horizontal trimpots (VR2 & VR3), the
latter used for a pre-set volume level.
If you don’t need volume control at all,
simply link out VR2 and VR3. Regardless, the wiper of each pot goes to the
non-inverting input for each channel
(pins 3 & 12) while the bottom (ACgrounded) end goes to the inverting
inputs (pins 4 & 11).
The TPA3113D2 can handle a
strictly limited voltage range at each
input pin of -0.3V to 6.3V so we have
added protection components to limit
these voltages when the power is off or
in case a high level signal is applied
(which is common when plugging and
unplugging RCA leads).
These parts consist of 5.6V zener diodes (ZD1-ZD4) and parallel Schottky
diodes (D1 & D2) between each input
and ground. The zener diodes take
care of clamping positive signal swings
while the Schottky diodes clamp negative excursions more effectively.
The outputs of IC1 pass through the
recommended output filter, consisting
of four large ferrite beads (FB1-FB4;
HI1812V101R-10) and four 1nF C0G
ceramic capacitors. C0G capacitors
have a very low temperature coefficient (±30ppm) but also low ESR
(equivalent series resistance) and
ESL (equivalent series inductance);
just what we need to suppress sharp
voltage spikes.
September 2014 77
Speaker impedance: 6-8Ω; 4-8Ω in mono mode or in stereo with up to 16V supply
Power LED1 (green) can either be an
on-board SMD LED or it can be mounted off-board via pin header CON7.
Supply current for LED1 and LED2
is around 1-2mA, so high-brightness
types should be used.
Continuous output power: 2 x 5W or 1 x 10W (12V, 8Ω)
Power supply
Specifications
Supply voltage: 8-25V DC
Quiescent current: typically <40mA active, <2mA shutdown
Peak output power: 2 x >15W or 1 x >30W (thermally limited)
THD+N: typically <0.1%; see Figs.6 & 7
Signal-to-noise ratio: 100dB
Frequency response: 20Hz-20kHz ±1dB; see Fig.9
Efficiency: up to 82% (stereo), 91% (mono)
Gain: 20dB, 26dB, 32dB or 36dB
Under-voltage lockout: ~7.5V
Output offset voltage: typically within ±1.5mV
Power supply rejection ratio: typically -70dB
Switching frequency: ~310kHz
We have also added snubbers, consisting of 330pF C0G ceramic capacitors in series with 10Ω resistors, from
each output to ground. They are actually wired to the boost supply pins but
these are AC-coupled to the outputs
via much larger 220nF capacitors so
the effect is the same. These reduce
radiated EMI further by limiting the
output voltage slew rates.
We have used a 1:1 voltage divider
between GVDD (pin 9; ~7V) and
ground, with a 4.7µF filter capacitor,
to set PLIMIT (pin 10) at 3.5V. This
limits the output amplitude to about
±11V (22V peak-to-peak). Thus it will
only limit the output power with a DC
supply over 20V.
If you are trying to get the maximum
possible power from the chip at 24V,
you could reduce the upper divider
resistor to 47kΩ but in most cases it
won’t make much difference; the ‘soft
clipping’ provided by this limiter may
have some benefits in reduced treble
artefacts if you are going to drive the
amplifier that hard anyway.
Other features
100kΩ pull-ups on GAIN0 and
GAIN1 allow links LK4 and LK5 to
define these input states. A table in
the circuit diagram shows the possible
settings. With a gain of 20dB (10x),
input sensitivity is 425mV RMS for
a 12V supply and 850mV RMS for a
24V supply. With the gain set to 36dB
(63x), input sensitivity is 67mV RMS
for a 12V supply and 135mV RMS for
a 24V supply.
The unit can handle signals up to
78 Silicon Chip
at least 3V RMS. For line-level signal
sources such as CD players, 20dB of
gain should be plenty, so most constructors should stick with that.
The FAULT output (pin 2) is connected to pin 1 on CON6, which can
go to a microcontroller pin (but with
some provisos, see below). It goes
low if the IC detects that an output is
short-circuited or there is a DC offset
fault. The FAULT signal also switches
P-channel Mosfet Q2 via a resistive
divider (which ensures that Q2’s gate
is not over-driven). If there is a fault,
Q2 switches LED2 (red) on. This can
either be an SMD LED mounted on the
board or an external LED wired up via
pin header CON8.
The shut-down input (pin 1) is also
connected to CON6 (at pin 2) and is
pulled up by a 100kΩ resistor so that
the amplifier will power up automatically. If pulled to ground, the amplifier
shuts down and only draws about
250µA. However, that doesn’t include
the current for LED1 and the various
pull-ups, which increase total shutdown current to around 2mA.
If a shorting block is placed on LK6
and an output short circuit is detected,
once the short has cleared, the amplifier will automatically resume operation. Otherwise, short circuit faults are
‘latched’ and the unit remains off (with
LED2 lit) until the power is turned off
and back on again.
Over-temperature faults are automatically cleared and LED2 will not
light if IC1 overheats; rather, output
will simply cease and then resume
once it has cooled.
The 8-25V DC supply (from a battery, plugpack or power ‘brick’) comes
in via terminal block CON3, with
Mosfet Q1 providing reverse polarity
protection. If the supply polarity is
correct, Q1’s gate is pulled positive
via the 100kΩ resistor. This switches
Q1 on, so current from the circuit can
flow back to the supply ground.
However, if the supply polarity is
wrong, Q1’s gate will be pulled negative relative to its source and Q1 will
remain off, so no ground current can
flow and the circuit is protected. Q1’s
drain-source voltage is rated at 25V, so
as long as the DC supply is within the
specified range, this will be sufficient
to block the supply voltage.
Zener diode ZD5 limits Q1’s gate
voltage to a safe level when the supply
voltage is above 20V.
There’s little else to the power supply other than the bypass capacitors,
which consist of one 100µF electrolytic, one 220nF X7R ceramic and
one 1nF C0G ceramic for each pair of
power VCC pins, ie, PVccL (pins 27
& 28) and PVccR (pins 15 & 16). The
analog supply, AVcc, is at pin 7 of IC1
and has a 10Ω/4.7µF RC low-pass filter
to remove switching noise.
IC1’s internal Mosfet gate supply
regulator has a 4.7µF output filter
capacitor at pin 9 (GVDD).
Mono (parallel) mode
To operate in mono mode, LK1 and
LK2 are fitted and LK3 is left out. The
speaker in then connected between
CON4 and CON5 as shown on the
circuit diagram. LK1, LK2 & LK3 are
0Ω surface-mount resistors.
In this case, you can also omit
FB2, FB3 and the two associated 1nF
capacitors. Plus you can omit CON1
and its associated components as the
mono signal is fed into the right input
(CON2).
Note though that you will only
get more power in mono mode (also
known as PBTL or Parallel Bridge-Tied
Load mode) with a low-impedance
speaker, eg, 4Ω. This is because with
higher speaker impedances, you will
run into clipping before the maximum
siliconchip.com.au
siliconchip.com.au
September 2014 79
2
2
1
10k
LOG
32dB
36dB
26dB
K1
VR1a
10k
D2
BAT54A
VR3
10k
K1
A
A
G
5.6V
5.6V
ZD3 A
K
ZD1 A
K
5.6V
5.6V
ZD4 A
K
ZD2 A
K
X7R
4.7 µF
GAIN
0
LK4
100k
10Ω
GAIN
1
LK5
100k
LK6
AUTO RESET
IN
IN
MONO
LK2
OUT
LK1
OUT
MODE
STEREO
OUT
IN
LK3
STEREO/MONO MODE LINKING
K2
K2
100k
100k
‘MINI–D’ 10W X 2 CLASS D AMPLIFIER
OUT
LOG
VR1b
10k
K
λ
A
D1
BAT54A
VR2
10k
10k
FAULT
LED2
D
S
Vcc
GND
X7R
4.7 µF
100k
X7R
4.7 µF
100k
X7R
A
ZD1- ZD4
K
100k
10
11
12
9
6
5
4
3
14
7
1
2
C0G
1nF
A
CATHODE
BAND
220nF
* EITHER DUAL LOG POT VR1 OR
TRIMPOTS VR2 & VR3 ARE FITTED;
THE LATTER FOR PRESET VOLUME
STEREO
LK3
100k
FAULT LOW ESR
100 µF
25V
SHUTDOWN
CON6
DIAG
27
15
BSPL
16
BSNR
OUTNR
OUTPR
BSPR
BSNL
OUTNL
OUTPL
PVccR
IC1
TPA3113D2
28
LEDS
K
8
0
K1
24
K2
BAT54A
19
AGND PAD PGND PGND
PLIMIT
RINN
RINP
GVDD
GAIN1
GAIN0
LINN
LINP
PBTL
AVcc
SD
FAULT
PVccL
A
21
20
18
17
22
23
25
26
X7R
330pF C0G
FB4
FB3
330pF C0G
330pF C0G
FB2
FB1
330pF C0G
LOW ESR
100 µF
25V
A
K
10Ω
1nF C0G
1nF C0G
10Ω
10Ω
1nF C0G
1nF C0G
10Ω
ZD5
5.6V
G
100k
G
S
D
IRFML8244, BSS84
PAD
UNDER
28
S
D
1
–
–
+
1
CON5
–
+
RIGHT
SPEAKER
2
DC
14
SPEAKER
CONNECTION
IN MONO
MODE
CON4
2
1
LEFT
SPEAKER
Q1
IRFML8244
CON3
1
POWER IN
2
+ 8–25V
TPA3113D2
NOTE: FB1–FB4 ARE HI1812V101R-10 SMD
FERRITE ‘BEADS’ (1812 SIZE, 8A RATED)
X7R
220nF
LK2
MONO
X7R
220nF
X7R
220nF
LK1
MONO
X7R
220nF
220nF
C0G
1nF
Vcc
Fig.4: the complete circuit diagram of the Mini-D 10W x 2 Class-D Amplifier. The audio input signals are fed in via CON1 & CON2, filtered and fed to the LINP
(pin 3) and RINP (pin 12) inputs of IC1 via dual-gang volume control VR1. The amplified outputs appear at pins 25 & 23 (left channel) and pins 18 & 20 (right
channel) of IC1 and these drive the left and right speakers via ferrite bead/capacitor filter networks. Links LK1-LK3 select either mono or stereo operation (see
table), while links LK4 & LK5 set the gain. Mosfet Q1 provides reverse polarity protection, while Mosfet Q2 drives the fault indicator LED (LED2).
SC
20 1 4
IN
OUT
OUT
IN
LK5
IN
OUT
4.7 µF X7R
4.7 µF X7R
4.7 µF X7R
4.7 µF X7R
K
Q2
BSS84
GAIN
20dB
POWER
λ LED1
LK4
IN
4.7Ω
C0G
1nF
(MONO INPUT)
RIGHT INPUT
CON2
100Ω
C0G
1nF
100Ω
4.7Ω
CON1
LEFT INPUT
CON8
K
A
(LED2 WHEN
OFF PCB)
CON7
A
K
1
(LED1 WHEN
OFF PCB)
A
100k 220nF
4.7 µF
0
+
LK3
STEREO
100 µF
(LK1)
10Ω
FB2
FB3
220nF 220nF
1nF 1nF
330pF
1nF
220nF
Lout
CON4
1nF
330pF
10Ω
FB1
1nF
CON5
4.7 µF
100k
330pF
10Ω
(LK2)
D2
ZD4
100k
IC1
TPA3113D2
LK5
LED1
LK4
LED2
1nF
4.7 µF
10Ω
Q1
10Ω 330pF
FB4
+
VR1
220nF
220nF
100k
100k
(VR3)
ZD5
–
100 µF
LK6
+
CON2
100Ω 4.7 µF
10kΩ + 10kΩ LOG
POWER
CON3 100k
G
CON6
S
100k
A 4.7 µF A
1nF
F
ZD2
ZD1
1nF
100Ω 4.7 µF
10k
10k
4.7Ω
Rin
100k
(VR2)
–
Right in
100k
–
CON1
ZD3
Lin
D1
4.7Ω 4.7 µF
Q2
Left in
Rout
INSTALL DOTTED LINKS AT VR2 & VR3
FOR FIXED VOLUME ONLY – SEE TEXT
NOTE: INSTALL LK3 (0 Ω) FOR STEREO. OMIT LK3 & INSTALL LK1 & LK2 FOR MONO
Fig.5: follow this parts layout diagram to build the Mini-D amplifier. You can either install
potentiometer VR1 or trimpots VR2 & VR3 for volume control (see text). Alternatively, leave
all these parts out if no volume control is required and link out VR2 & VR3 as indicated.
output current becomes the limiting
factor. With a 4Ω speaker at 15V in
mono mode, output power is up to
30W, which is pretty good! Even if
you don’t need the extra power, it’s
preferable to use the module in mono
mode as it improves efficiency.
24V battery operation
Since the maximum recommended
operating supply voltage for IC1 is 26V
and there are a number of 25V-rated
components in the circuit, we don’t
recommend running directly from a
24V battery. In theory, if you increased
the voltage ratings of the 25V capacitors and Mosfet Q1, you might get away
with it as the absolute maximum specified for IC1 is 30V. But it’s outside the
recommended operating voltage range
so we don’t suggest doing that.
A better option is to use a 24V lowdropout pre-regulator, eg, by placing
a 12V zener diode in series with the
ground pin of an LM2940CT-12 regulator to ‘jack it up’ to 24V. You will need
appropriate input and output filter
capacitors. The LM2940 is only rated
at 1A but is unlikely to run into current
limiting during normal operation. It
may need a small heatsink though, as
it could dissipate up to 5W.
PCB layout
Being a switching amplifier, instantaneous currents can be high and the
voltage rise/fall times are very short,
so the the design of the PCB has been
quite rigorous. We also wanted to keep
switching noise away from the analog
circuitry. Bypass capacitors need to
be near IC pins and the output filter
must be kept tight for maximum EMI
suppression. There are also thermal
considerations, given that the amplifier
80 Silicon Chip
IC uses the board as a heatsink.
We’ve placed ground planes on both
the top and bottom of the board immediately under IC1 and fanned them out
to the full width of the board. There are
15 vias placed directly under the IC,
on and around its thermal pad, both
to reduce ground impedance for better performance and to help conduct
heat from the IC to the bottom side of
the board where it can be effectively
radiated away.
The 1nF and 220nF bypass capacitors are immediately adjacent to the
IC, with the 1nF C0G types the closest,
as they have the best high-frequency
performance. The placement of the
100µF electrolytics is less critical. Note
that there is provision to use 22µF 25V
SMD multi-layer ceramic capacitors
(1812 size) instead but the cheaper
electros do the job well.
The IC’s pin layout is well-optimised, with the main power supply
and all output related pins on one side,
which we have orientated towards the
right side of the PCB. Thus the filter
components are placed immediately
between the IC and CON4/CON5 at
right. The analog ground pin (pin 8) is
on the left side of the IC and this is the
only point at which the power ground
meets the signal (analog) ground.
Construction
Fig.5 shows the assembly details.
Apart from some of the components
being relatively close together, the only
tricky thing about building this board
is soldering IC1 (a magnifying lamp
will come in handy here).
We used hot-air reflow as this (or
oven reflow) is best for ICs with thermal pads (like the TPA3113D2). The
equipment is surprisingly cheap; we
paid around $60 for an Atten 858D+
hot-air soldering station while hot-air
reflow wands can be had for as little as
$25. But you can do it with a regular
soldering iron too.
For hot-air, the trick is to use a very
thin layer of fresh solder paste (kept
in the fridge!). Spread this sparingly
on the pads, drop the IC on top, heat it
(gently at first) until all the pins reflow
and then for a few seconds longer and
Bob’s your uncle.
If all you have is a regular iron, apply
some no-clean flux paste to the thermal
pad on the board and also the pad on
the bottom of the IC. Then melt a small
amount of solder to both; just enough
to tin them. Start with the PCB pad
so you can get an idea of the correct
amount. If you add too much, add a bit
more flux and then remove the excess
with some solder wick (harder to do
with the IC!).
Having tinned both, place some
fresh flux paste on all the IC pads
on the PCB, including the thermal
pad, then pop the IC down in place,
checking its orientation. Next, move it
slightly out of the way, tin one small
corner pad and then slide the IC into
place while heating that pad.
Now check that the IC lines up with
all its pads. If it’s misaligned, reheat
and gently nudge it into place. Try to
avoid getting solder on any other pads
Use a magnifying glass (or magnifying lamp) to check carefully that all
the pins are sitting properly over their
pads, then tack down the diagonally
opposite pin. Re-check the alignment,
then solder the rest of the pins, making
sure not to disturb either of those first
two solder joints.
Having soldered the pins, it will
then be necessary to flip the board over
siliconchip.com.au
and apply enough solder to the pad
on the bottom to transfer heat through
the vias. Heat this solder until the flux
between the IC and board vapourises,
indicating that the thermal pad has
reflowed. This will take a good few
seconds but don’t overdo it as you
could cook the chip.
Regardless of which method you
used to solder the IC, check carefully
for bridged pins (again, use a magnifying glass) and clean up any that look
dodgy up with some flux paste and a
clean piece of solder wick. The bridges
should clear easily; press the wick
down onto the board but not over the
IC pins as they are small and easily
damaged.
As a final measure, it’s a good idea
to clean the flux residue off the board
using a specialised flux cleaner (or in
a pinch, an alcohol or acetone) and
then carefully check all the soldering,
again with a magnifying glass. Check
that all the bridges are gone and that
the solder has flowed cleanly onto all
the pins and pads.
Remaining parts
There are nine SOT-23 package
transistors, diodes and zener diodes to
solder. These are quite easy as the pins
are well spaced but don’t get the various device types mixed up. Start with
Q1 and Q2, then solder D1 and D2 and
finally the five identical zener diodes.
The easiest method is to put a bit of
solder on the central pad and slide the
device into place while heating that
pad. Then solder the other two pads (a
dab of flux paste makes it easier) and
refresh the first.
Now move onto the SMD passives,
starting with the resistors and then
the capacitors and ferrite beads. Use
siliconchip.com.au
Mini-D THD+N vs Power
08/12/14 13:27:27
Filter: AP AUX-0025 + 20Hz-80kHz bandpass
Total Harmonic Distortion + Noise (%)
5
2
1
0.5
4Ω+47µH <at> 15V
0.2
0.1
8Ω+47µH <at> 18V
4Ω+47µH <at> 12V
0.05
8Ω+47µH <at> 12V
0.02
0.01
0.1
8Ω+47µH <at> 14.4V
Solid = Stereo mode
Dashed = Mono mode
0.2
0.5
1
2
5
10
20
Power ( W atts)
Fig.6: distortion versus power for a range of load impedances and supply
voltages. Performance is generally better for 8Ω loads but power delivery is
higher into 4Ω. Note the test load series inductance, to simulate loudspeakers.
10
Mini-D THD+N vs Frequency
08/12/14 13:28:51
Filter: AP AUX-0025 + 20Hz-80kHz bandpass
5
Total Harmonic Distortion + Noise (%)
Left: the completed
PCB assembly. Don’t
be intimidated by the
SMD parts; they’re
quite easy to install
if you follow the
instructions in the
text but you do need
a good magnifying
glass (or magnifing
lamp), tweezers and a
soldering iron with a
small chisel tip.
10
2
1
0.5
0.2
4Ω+47µH <at> 12V, 1W
0.1
0.05
8Ω+47µH <at> 12V, 1W
0.02
0.01
20
50
100
200
500
1k
2k
5k
10k
20k
Frequency (Hz)
Fig.7: distortion versus frequency at 1W. As usual, the distortion rises with
frequency but it also rises at the low end due to coupling capacitor-induced
distortion. It’s below 0.1% between 40Hz and about 1.5kHz.
a similar method as for the SOT-23s.
The main thing to check for with these
parts is that the solder has flowed onto
the pad and not just the end of the
component. As before, adding flux
smoothes solder flow.
Note that the resistors will have
printed values on them but the capacitors and ferrite beads will not,
so check the packaging before fitting
them. Remember to fit either 0Ω resistor LK3 only (stereo mode) or LK1 and
LK2 only (mono mode).
If using the SMD LEDs, they can
September 2014 81
V+
VCC
CON3
+
S1
K
K
A
A
−
(OPTIONAL CLAMP DIODES)
MICROCONTROLLER
1
1k
2
470nF
1
FAULT
POWER
10Ω
SHUTDOWN
2
100 µF
25V
MINI-D
3
MINI-D
FAULT
SHUTDOWN
3
GND
CON6
GND
CON6
B: START-UP DELAY & SHUTDOWN WITH A SWITCH
A: CONNECTING A MICROCONTROLLER TO THE MINI-D
Fig.8(a): the shutdown pin (pin 2) of CON6 can be pulled low under no-signal conditions (eg, using a microcontroller)
to reduce power consumption. The RC filter shown provides slew rate limiting, while external clamp diodes may also
be required with some micros (see text). Fig.8(b) at right shows how to add a capacitor (eg, 100μF) to give a switch-on
delay, while a DPDT power switch (S1) can be used to eliminate switch-off clicks or pops.
go in next but first you will have to
check their polarity. Unfortunately,
markings are inconsistent so use a
DMM in diode test mode and try connecting the probes both ways around.
When the LED lights, the red probe is
to the anode and this goes towards the
bottom of the PCB (marked with “A”).
We used a green LED for LED1 and a
red LED for LED2.
Through-hole components
That’s it for the SMDs so once
you’re confident that they’ve all been
+3
soldered correctly, there are just a few
through-hole parts left. If you aren’t using an on-board volume control, solder
wire links in place of VR2 and VR3
where shown. Also, if using off-board
LEDs, fit 2-way pin headers CON7 and
CON8 in place of the LEDs.
Next, move on to links LK4-LK6,
CON6 and the inputs (if you aren’t fitting RCA sockets). That done, dovetail
two screw terminal blocks together
and solder them in place for CON4
& CON5 (wire entry holes facing outwards). CON3 can then go in.
Mini-D Frequency Response
08/12/14 12:39:04
Filter: AP AUX-0025 + 80kHz lowpass
+2.5
+2
Amplitude Variation (dBr)
+1.5
+1
+0.5
+0.0
-0.5
-1
-1.5
Set-up & testing
Initially, fit LK4 and LK5 (note that
they go in vertically) and LK6. Turn
the volume pot(s) to minimum, then
apply DC power to CON3 (say, 12V)
and measure the current. It should
be just under 40mA (but possibly as
high as 55mA) and LED1 should be on
while LED2 should be off. If anything
is wrong, switch off immediately and
check for faults. Also double-check
that you have connected the supply
wires with the correct polarity.
Assuming that all is OK, switch off
and connect a signal source such as a
CD player, MP3 player, oscillator or
mobile phone. Connect the speaker(s),
then switch back on and slowly turn
the volume up. It’s now just a matter
of making sure it sounds right. If you
get to maximum volume and it’s still
too quiet, switch off and increase the
gain by changing LK4 and/or LK5 but
remember to turn the volume down
before re-applying power.
Shutdown control
-2
-2.5
-3
If you are using onboard volume
control pot VR1, fit it now (or trimpots
VR2 & VR3). RCA sockets CON1 &
CON2 can then go in, followed by the
electrolytic capacitors (take care with
their orientation).
20
50
100
200
500
1k
2k
5k
10k
20k
Frequency (Hz)
Fig.9: the amplifier’s response is effectively flat in the audible frequency range.
There is a low-frequency roll-off due to the high-pass filter formed by the
input coupling capacitors and volume pot, while the rise at the high end can
be attributed at least partially to the inductance of our test load.
82 Silicon Chip
To reduce power consumption
when power is applied but no signal
is present, you can pull the shutdown
input (pin 2 of CON6, pin 1 of IC1) low
to enter a power-saving state. However,
there are a couple of provisos.
First, the data sheet specifies that
this pin should be slew rate limited to
10V/ms unless the source impedance
siliconchip.com.au
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USB-based spectrum analyzers
and RF recorders.
The TPA3113D2 IC (circled) should be installed first, following the procedure
described in the text. The photo above right shows the corresponding heatsink
area for this IC on the back of the PCB. It’s connected to a thermal pad on the
top of the board by 15 vias.
This larger-thanlife-size view shows
the heatsink pad on
the underside of the
TPA3113D2 Class-D
audio amplifier IC.
is at least 100kΩ but it doesn’t say why.
Confusingly, they also show sample
circuits where a “control system” (eg, a
microcontroller) drives the shutdown
pin via just a 1kΩ series resistor, which
is unlikely to limit the slew rate to their
specification.
We would be tempted to try that but
not knowing the reason for the limitation, a safer approach would be to
add an RC filter, as shown in Fig.8(a).
The same comments apply if you’re
going to use a switch, relay, transistor
or something else to pull down the
shutdown pin.
If connecting a micro in this manner,
note that the on-board pull-up resistor
could pull its control pin above the
micro’s supply voltage. Normally, the
microcontroller pin will have a clamp
diode to its positive supply rail to limit
the voltage on that pin to a safe level.
However, some micros lack a positive
clamp diode (eg, 5V-tolerant pins on a
3.3V micro) and in that case, you will
need to add an external clamp diode
(or a low-voltage zener to ground) to
protect the micro – see Fig.8(a). The
situation is the same if connecting the
FAULT signal to a micro.
Powering up & down
We didn’t hear any clicks or pops
or run into other issues when powering the Mini-D up or down normally
but there are a couple of issues noted
in the data sheet which constructors
should be aware of.
If the signal source is powered up
at the same time as the Mini-D and
there are large initial transients on
those signals, that could trigger the
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Another view of the completed PCB
assembly. Links LK1-LK3 have been
configured for stereo operation; ie,
LK1 (0Ω) in, LK2 & LK3 out.
DC offset protection in the Mini-D
and once that’s activated, its outputs
will remain disabled until the power
is switched off and on again. So in that
case you need to hold shutdown low
until the audio signals stabilise. This
can be achieved with a capacitor between the shutdown pin and ground.
A 22µF capacitor will give a switch-on
delay of around 100-200ms, a 100µF
500-1000ms and so on. Or if a micro
is connected to shutdown, it can do
the same job.
The data sheet also states that
pulling shutdown low before power
is removed will minimise clicks or
pops. While not strictly necessary, this
can be achieved using a DPDT power
switch; see Fig.8(b). This will bring
shutdown low almost immediately
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SC
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September 2014 83
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