This is only a preview of the May 2015 issue of Silicon Chip. You can view 29 of the 104 pages in the full issue, including the advertisments. For full access, purchase the issue for $10.00 or subscribe for access to the latest issues. Articles in this series:
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Dis
By JIM ROWE
A 2-Channel Balanced Inp
For Audio Analysers & Dig
This project is designed to extend the measurement capabilities of
low-cost USB test instruments like the QA400 Stereo Audio Analyser
or the USB DSOs we reviewed recently. It provides balanced/
differential inputs for each channel in addition to unbalanced
inputs, combined with three attenuation/measurement ranges: 1:1,
10:1 and 100:1.
B
ACK IN MARCH, we reviewed the
QuantAsylum QA400 low-cost
USB Stereo Audio Analyser and we
were most impressed with its performance capabilities. Yet at the same
time we were disappointed with two
limitations, which restricted its practi64 Silicon Chip
cal applications quite severely.
One limitation was a maximum
input level of only 1.41VRMS/4.00V
peak-peak for both input channels.
That makes it fairly useless for a lot
measurements; you would have to use
external input attenuators if the QA400
were to be used for making useful
measurements on hifi, guitar and PA
amplifiers.
The QA400 also only provided unbalanced inputs, whereas you need
balanced inputs in order to efficiently
test professional audio equipment. Balsiliconchip.com.au
1 µF
+2.5V
250V
22pF
1M
90.0k
0.1%
/1
/10
2
33Ω
+IN
A
9.0k
0.1%
/100
D2
LOW NOISE & DISTORTION DIFFERENTIAL AMPLIFIER
–IN
R1
+IN
R1
1.0k
0.1%
1 µF
250V
22pF
1M
90.0k
0.1%
–2.5V
D3
/1
/100
S1b
A
D4
A
1.0k
0.1%
R1
K
K
9.0k
0.1%
OUTPUT
+2.5V
68Ω
/10
–2.5V
Fig.1: the basic configuration used for each
channel of the 2-Channel Balanced Input
Attenuator. The balanced inputs (+IN and
-IN) feed a matched pair of attenuator/
dividers with ganged switching, followed by
a differential amplifier to subtract the two
signals and provide the unbalanced output.
Left: the 2-Channel Balanced Input Attenuator is built into
a case that’s almost exactly the same size as QuantAsylum’s
QA400 Stereo Audio Analyser, so that the two can be
stacked together.
put Attenuator
gital Scopes
anced or differential inputs also allow
instruments like the QA400 to be used
to make accurate measurements on
signals at the output of bridge-mode
analog amplifiers or class-D digital
amplifiers where neither side of the
outputs is earthed.
As a result, we realised that the
applications of instruments like the
QA400 could be greatly expanded by
designing an “outboard” 2-channel input attenuator to allow measurements
at significantly higher audio power
levels, combined with balanced/differential inputs for each channel in
addition to unbalanced inputs.
Such a project is not restricted to
siliconchip.com.au
R1
A
RANGE SWITCHING
33Ω
3
D1
S1a
K
BALANCED
INPUT
–IN
1
K
68Ω
enhancing audio analysers like the
QA400, either. Many, if not most, lowcost USB DSOs have similar limitations, and would therefore benefit in
the same way. And we should also
mention the Digital Audio Millivoltmeter described in the March 2009 issue of SILICON CHIP, which had similar
limitations.
Finally, we should also mention
that this project would make a useful
addition to any oscilloscope when
you need differential inputs, albeit its
bandwidth does limit its use to signals
with harmonics no higher than 750kHz
(eg, square-wave signals to about
75kHz) – see specifications panel
So you can see the design concept
is quite straightforward but producing
a design which was “good enough”
turned out to be a real challenge.
This was largely because of the need
to introduce as little additional noise
and distortion as possible, because
this would detract from the excellent
performance of the QA400.
Basic configuration
Fig.1 shows the basic configuration for one channel: balanced inputs
(+IN and -IN) feeding a matched pair
of attenuator/dividers with ganged
switching, followed by a differential
amplifier to subtract the two signals
and provide the unbalanced output.
Don’t worry about the circuitry
shown inside the differential amplifier at present – we’ll move onto that
shortly. Just note that the purpose of
Schottky diode pairs D1/D2 and D3/
D4 at each input of the differential
amplifier are to limit the signal levels
to within windows between ±2.7V, to
protect both the differential amplifier
and the input of a following instrument, such as the QA400.
The 68Ω resistors in series with the
“/1” position of switches S1a & S1b
are there to limit the current in these
diodes, together with the 33Ω resistors
in series with each input.
Ideally we’d like to make these
series resistors somewhat larger than
May 2015 65
The front panel carries two 3-pin XLR sockets for the balanced inputs, two BNC sockets for unbalanced inputs and
the range selector switch.
101Ω (= 33Ω + 68Ω), because the
diodes we’re using for D1-D4 have a
fairly low maximum current rating.
However, we are forced to compromise
at the values shown because these resistors are directly in series with the
inputs when S1 is switched to the 1:1
range. This means that their thermal
(Johnson) noise is added directly to
the input signals, thus degrading the
attenuator’s noise performance.
As set out later in an accompanying
panel, the thermal noise generated in a
resistor is directly proportional to the
square root of its resistance multiplied
by the absolute temperature and the
bandwidth being used. This means
that if we were to increase the value
of the input series resistors to, say,
1kΩ, the RMS thermal noise voltage at
each input of the differential amplifier
would rise from 186.79nV (-134.6dBV)
to 587.6nV (-124.6dBV), measured at
25°C and over the band from 20Hz to
21.0kHz.
In other words, the noise level at
–IN
820Ω
each input would be degraded by
some 10dB.
Note that since the two sources of
thermal noise are not correlated, the
output noise level of the differential
amplifier would be degraded by a further 6dB even if the amplifier itself was
totally noiseless. So with the resistor
values shown in Fig.1, the RMS output
noise level will always be above 373nV
(-128.6dBV), while if the input resistors were increased to 1kΩ it would
always be above 1.175µV (-118.6dBV).
Those 33Ω resistors in series with
each input are mainly to form low-pass
filters in conjunction with the 22pF
shunt capacitors, to improve the RFI/
EMI rejection of the overall circuit.
You’ll find that in the final circuit we
have also fitted small inductors in series with the 33Ω resistors, to further
improve EMI rejection.
The 1µF coupling capacitors on
each input reject any DC that may be
present, while having minimal effect
on the low frequency response. And
820Ω
OUTPUT
+IN
820Ω
820Ω
66 Silicon Chip
Fig.2: to achieve
better performance
in terms of noise
and distortion, this
is the configuration
used for the output
differential amplifier.
In practice, an array
of four of these are
used in parallel.
the 1MΩ shunt resistors on the input
side of the capacitors are to bleed away
any charge remaining on those capacitors when the inputs are disconnected
from a source of DC.
Finding the right amplifier(s)
Let us now consider the crucial
aspect of the project’s design: how to
achieve the best noise and distortion
performance from the output differential amplifier section (shown inside
the dashed rectangle of Fig.1). In other
words, which is the best op amp to use
and what is the best configuration to
use it in?
We began by searching through all
the data we could find on low noise,
low distortion op amps. Initially, this
led us to the Analog Devices AD797,
a device with particularly impressive
noise and distortion specs: 1.2nV/√(Hz)
maximum input voltage noise density between about 80Hz and beyond
10MHz, coupled with a typical THD
figure of -120dB at 20kHz.
However when we looked closely
at the performance of the AD797
when used as a differential amplifier,
we found that its noise performance
wasn’t as good: the output voltage noise
spectral density jumped up to around
9nV/√(Hz), giving an RMS noise output
of close to 1.3µV (-117.5dBV) over the
20Hz – 21kHz audio bandwidth.
Even to achieve this level of performance, the resistor values shown as
R1 in Fig.1 had to be lowered to 1kΩ,
making it very difficult to achieve a
total input resistance of more than 2kΩ
siliconchip.com.au
on the 1:1 range of S1. This obviously
wasn’t high enough, suggesting that
voltage follower/buffers were going
to be needed ahead of the differential
amplifier.
There was one more drawback regarding the AD797 – its price, which
in Australia turns out to be $14.51 plus
GST. Since at least two of these were
going to be needed (one per channel),
this meant that the op amps alone
would account for just on $32 of the
project’s cost.
So we looked for an alternative approach. And ultimately we found such
an approach in the book Small Signal
Audio Design (Focal Press/Elsevier,
Second Edition 2015; ISBN 978-0-41570973-6), by renowned audio engineer
Douglas Self. In chapter 18 of this book,
starting on page 483, Douglas Self gives
a great deal of useful information on
the design of low-noise balanced input
stages.
He explains why the standard differential amplifier configuration like
that shown in Fig.1 cannot achieve
an output noise level as low as an unbalanced input stage using the same
op amp, unless the resistor values are
reduced to a level that gives an unacceptably low input resistance – regardless of the actual op amp being used.
He then explains that the best approach is to use the configuration
shown in Fig.2, where the differential
amplifier is preceded by a pair of op
amps connected as voltage follower
buffers. This allows the four resistors
around the differential amplifier to be
reduced to a value giving an acceptable
noise level, while the voltage followers provide a unity-gain impedance
step-up for the two inputs.
At the same time, the input buffers
don’t degrade the CMRR (commonmode rejection ratio), because this is
still defined by the tolerance of the
820Ω resistors around the differential
amplifier and also by its bandwidth.
Douglas Self then goes on to analyse
the performance of this configuration
and explain why the resistor values
can’t really be reduced below 820Ω,
without degrading the distortion performance. (This is mainly because of
the current drive capability of the input buffers and also of the differential
amplifier itself.)
He explains that by using 820Ω resistors with the well-known (and much
lower cost) 5532 low-noise op amps in
all three positions, the noise output of
siliconchip.com.au
Main Features & Specifications
Description: a 2-channel balanced input attenuator with low noise and distortion
suitable for extending the measurement range of audio analysers and digital
oscilloscopes (both self-contained and USB linked). It provides a choice of either
balanced/differential or unbalanced inputs for either or both channels, plus the ability to
quickly select one of three measurement ranges.
Input resistance (DC): 1MΩ
Input impedance (AC): 100kΩ shunted by approximately 25pF
Maximum input voltage: 10V to ground, 20V peak-to-peak/7V RMS differential on
0dB range; 100V to ground, 200V peak-to-peak/70V RMS differential on other ranges
Output clipping level: approximately 4V peak-to-peak (1.4V RMS sinewave)
Attenuation/measurement ranges: 1:1 (0dB); 10:1 (-20dB); 100:1 (-40dB)
Frequency response (both channels):
0dB range: ±0.1dB from 11Hz – 35kHz, -3dB at 750kHz
-20dB range: ±0.1dB from 11Hz – 20kHz, -0.5dB at 35kHz, -3dB at 1.5MHz
-40dB range: ±0.1dB from 11Hz – 10kHz, -0.3dB at 20kHz, -3dB at 4.25MHz
(Note: these figures apply for both balanced and unbalanced inputs)
Gain/attenuation accuracy: ±2% (±0.2dB)
Signal-to-noise Ratio (20Hz-80kHz measurement bandwidth):
0dB range: 114dB with respect to 1.4V RMS input/output
-20dB range: 108dB with respect to 14V RMS Input/1.4V RMS output
-40dB range: 98dB with respect to 26.6V RMS input/266mV RMS output
Output noise level:
0dB range: -136dBV (158nV) 400Hz-40kHz; -113dBV (2.24µV) at 15Hz
-20dB range: -138dBV (126nV) 400Hz-40kHz; -116dBV (1.6µV) at 15Hz
-40dB range: -138dBV (126nV) 200Hz-40kHz; -116dBV (1.6µV) at 15Hz
Total Harmonic Distortion (20Hz-80kHz measurement bandwidth):
0dB range: <0.0005%, 20Hz-20kHz
-20dB range: <0.0005% 20Hz-2kHz, <0.0025% 2kHz-20kHz
-40dB range: <0.002% 20-25Hz, <0.0015% 25Hz-2kHz
Channel separation with a 1V RMS signal (QA400 Analyser alone: 100dB):
0dB range: >100dB, 20Hz-20kHz
-20dB range: >80dB, 20Hz-1kHz; >60dB, 1kHz-20kHz
-40dB range: >95dB, 20Hz-1kHz; >70dB, 1kHz-20kHz
Common mode rejection ratio:
0dB range: >60dB, 20Hz-20kHz; typically >80dB
-20dB range: >50dB, 20Hz-20kHz; typically >65dB at 1kHz
-40dB range: >40dB, 20Hz-20kHz
Power supply: runs from an external ±15V DC supply, with a current drain of
approximately 200mA
the Fig.2 configuration can be lowered
to -112.4dBV. This is about 7.3dB above
the level that could be achieved with a
single AD797 differential amp, so it’s
still not good enough.
Multiple op amps
& noise cancellation
As Douglas Self moves on to explain,
there is a fairly easy way to improve
noise performance quite significantly:
by using an array of identical differential amplifiers driven by an array of
input buffers. So that’s what we are
using in this project, with four differential amplifiers connected in parallel, driven by four pairs of unity-gain
input buffers.
The thinking behind this is that
connecting two identical amplifiers in
parallel causes the noise generated in
each to mostly cancel, because they are
not correlated. This happens each time
the number of amplifiers is doubled, so
that by using four identical differential
amplifiers in parallel, we can achieve
a 6dB drop in the overall noise output.
Similarly, we can achieve a further
3dB drop in noise output by using a
separate pair of input buffers for each
differential amplifier, to achieve better
buffer noise cancellation.
The end result of moving to this
eight-buffers-driving-four-differentialamplifiers configuration gives a total
improvement in noise level of about
May 2015 67
9dB – so even if we use 5532 op amps
throughout, the noise output level
drops to -119.2dBV. This is a couple
of dB better than we could achieve
with a single AD797, even if it were
preceded by a couple of AD797s as
input buffers.
But what about the price to be paid
for this increase in circuit complexity, in order to achieve that low noise
level? The good news is that the 5532
device is a dual op amp, whereas the
AD797 is only a single op amp. So we
only need six 5532 devices at a current
price of around $2.00. So the total op
amp price tag for one channel is only
about $12 – less than the price of a
single AD797.
The end result is that by using Douglas Self’s “array” technique, we are
able to achieve an impressive output
noise level of -119.2dBV in our two
channels. We do have to allow for a
more complex PCB but we believe that
the end result is worth it.
Circuit description
Now have a look at Fig.3 which
shows the circuit of the left channel
(the right channel is identical). Notice
that we have added an unbalanced input, using CON2, to provide the option
of connecting the attenuator channels
to unbalanced signal sources.
As previously mentioned, inductors
RFC1 & RFC2 have been included in
series with the 33Ω suppressor resistors
at the three inputs, to provide additional rejection of RFI/EMI signals. RFC1
is bifilar wound to provide improved
rejection.
Note that we provided for discrete
high-frequency compensation capacitors across the upper arms of the attenuator dividers, marked C1 and C2. We
thought that these would be needed
to compensate for the capacitance of
the input voltage limiting diodes D1D4 and the input capacitance of the
array of voltage followers (IC1, IC3,
IC4 & IC6).
However, during prototype testing, we discovered that discrete
compensation capacitors were not
necessary – partly due to the very
low capacitance of D1-D4 and partly
to incidental capacitance between the
short lengths of wire connecting the
lugs of range switch S1 to the PCB. As
can be seen in the specification panel,
the resulting frequency response is
quite acceptable.
Note that the outputs of the four
68 Silicon Chip
differential amplifiers (IC2a/b and
IC5a/b) are combined using 10Ω (1%)
resistors. This ensures that the final
output at CON3 is an average of the
four differential amplifier outputs
and they won’t “fight” each other. As
a result, there is no drop in signal gain
but there is a welcome drop in noise
output due to cancellation.
Before leaving the circuit of Fig.3
we should perhaps draw attention to
the notes panel. Part numbers for the
right channel circuit are listed here
and also shown on the circuit in grey.
Power supply details
Now let’s move on to consider
the Attenuator’s power supply. Natsiliconchip.com.au
Fig.3: the complete circuit for the left channel of the 2-Channel Balanced Input
Attenuator (the right channel is identical). It’s based on six NE5532D dual lownoise op amps (IC1a-IC6b, plus six more for the right channel.
urally both the ±15V supplies for the
op amps and the ±2.5V rails for the
input clipping diodes need to be as
quiet as possible, if the full low noise
performance of the attenuator itself is
to be realised.
The first approach we tried was a
fairly standard configuration with an
external 17VAC plugpack feeding two
siliconchip.com.au
half-wave rectifiers, each of which
was then driving a 15V regulator followed by a 2.5V regulator. Apart from
the external AC plugpack, everything
was on the same PCB as the rest of the
attenuator’s circuitry and therefore
inside the shielding metal box.
While this did work, it proved to be
virtually impossible to prevent 50Hz
hum components and their harmonics
from finding their way into the signal
circuitry – possibly via radiation from
the tracks on the PCB carrying current
between the rectifier diodes and the
input filter capacitors.
The only practical way to solve this
problem was to remove the rectifiers,
input capacitors and ±15V regulators
from both the PCB and the box, and
modify the design so that the unit
is operated from a well-filtered and
regulated external ±15V DC supply.
As it happens, we were also developing an enhanced version of
the March 2011 Universal Regulator
module, so the logical approach was
to arrange for one configuration of
this new Universal Regulator Mk2 to
be used for the Attenuator’s external
±15V supply. You’ll find the Universal
Regulator Mk2 described elsewhere in
this issue.
Redesigning the attenuator in this
way allowed us to simplify its internal
power supply circuit to that shown
in Fig.4. It has the two incoming 15V
supply lines passing directly through
to the attenuator’s op amps and a
pair of low-power TO-92 adjustable
regulators (REG3 and REG4) used to
provide the ±2.5V rails for the clipping
diodes. A 3mm green LED (LED1) is
connected between the two 2.5V rails
via a 330Ω series resistor to provide
power indication.
Because the 17V AC plugpack we’re
using with the Universal Regulator
Mk2 has an untapped secondary winding, we are forced to use a half-wave
rectifier configuration. However, at the
same time, this plugpack does provide
a mains earth output lead and to make
use of this we decided to pass this
mains earth through the new Universal
Regulator Mk2 PCB and thus make it
available for load equipment like our
Balanced Input Attenuator.
By connecting the attenuator to
the regulator module using a four
conductor shielded cable as shown at
the bottom of Fig.4, we were able to
bring the mains earth right through to
pin 2 of the attenuator’s power input
connector (CON7). As a result, the attenuator’s metal shielding box can be
permanently connected to mains earth
for shielding.
However, the earth/0V side of the
attenuator’s circuitry should not be
connected permanently to this mains
earth, because in some measurement
situations this would have the potenMay 2015 69
+15V
REG3 LM317L
+15V
1
0V
4
IN
2 MAINS
CON7
ADJ
EARTH LIFT
S2
+2.5V
OUT
100nF
+2.5V
120Ω
470 µF
10 µF
16V
330Ω
16V
EARTH
120Ω
5
3
120Ω
0V
BOX
100nF
A
10 µF
470 µF
120Ω
ADJ
–15V
IN
OUT
POWER
λ LED1
16V
16V
K
–2.5V
–2.5V
REG4 LM337L
–15V
LM317L
LED
LM337L
OUT
OUT
K
IN
A
ADJ
IN
ADJ
(SHIELDING BRAID)
TO CON2
ON
UNIVERSAL
REGULATOR
Mk2 Ver.C *
–15V
E
SC
1
2
0V
5
4-CONDUCTOR SHIELDED CABLE
INTERCONNECTING POWER CABLE
20 1 5
4
+15V
2-CHANNEL BALANCED INPUT ATTENUATOR
3
5-PIN DIN
PLUG
(MATES WITH
CON7 OF
ATTENUATOR)
* DESCRIBED SEPARATELY IN THIS ISSUE
INTERNAL POWER SUPPLY CIRCUITRY
Fig.4: the power supply circuitry built into the Balanced Input Attenuator, plus the wiring of the power cable used to
run the unit from the Universal Regulator Mk2 module described elsewhere in this issue.
tial to create an “earth loop” and hence
inject 50Hz hum into the attenuator’s
signal circuitry.
That’s why we have fitted EARTH
LIFT switch S2, so that the connection between the attenuator’s earth
and mains earth can be broken, to see
which setting gives the better results.
Note that the cable used to connect
the attenuator to the regulator module
should be shielded, as shown at the
bottom of Fig.4. This is to ensure that
hum and EMI are not picked up and
fed into the attenuator via the ±15V
power lines. It is the shield braid that
also connects the mains earth to the
attenuator, via pin 2 of CON7.
Construction
Building it is straightforward, with
all parts (except for range selector
switch S1) mounted on a double-sided
PCB coded 04105151 and measuring
160 x 80mm. This board is housed
in a small extruded aluminium case
measuring 170 x 85 x 54mm (W x D x
H). It’s similar in size to the case used
for the QA400 Audio Analyser, making
it easy to stack the two together.
70 Silicon Chip
Figs.5 & 6 shows the parts layout on
the PCB. As shown most of the parts
are fitted to the top of the PCB. The
only parts mounted on the bottom are
output buffers IC5 & IC12 and their
associated components. These are all
fitted in the two areas indicated on the
underside overlay (Fig.6).
All of the parts used in the input sections of the Balanced Input Attenuator
(ie, ahead of range switch sections
S1a-S1d) are conventional “leaded”
components. This was done to give
maximum ruggedness and reliability,
and to make the assembly easier. The
power supply circuitry along the rear
of the PCB also uses leaded components. However, SMD parts are used
in the signal circuitry between S1 and
output connectors CON3 & CON6.
PCB assembly
Here is our suggested order of assembly, to make this task as easy as
possible:
Step 1: fit the SMD resistors and capacitors to the top of the PCB.
Step 2: fit SMD diodes D1-D8. These
go on the top side near the front cen-
tre of the PCB (behind where S1 will
be after final assembly). Be sure to fit
each diode with the orientation shown
in Fig.5.
Step 3: install the NE5532D dual op
amp ICs to the top side of the PCB
(IC1-IC4 & IC6-IC11). These come in
an SOIC 8-lead SMD package. Make
sure that you fit each IC with the correct orientation.
Don’t worry if you get solder bridges
between the pins when soldering these
ICs in; they can be easily removed
afterwards using solder wick and a
hot iron.
Step 4: repeat step 1-3 for the parts on
the underside of the PCB – see Fig.6.
Step 5: once all the SMD components
are in place, install the resistors followed by the non-polarised capacitors
and the polarised capacitors. Regulators REG3 & REG4 and LED1 can then
go in. The latter must be fitted with its
longer anode lead towards the centre
rear of the board and with its body
18mm above the PCB (use a cardboard
spacer between the leads).
The LED is later bent down through
90° so that it protrudes through a
siliconchip.com.au
(TOP OF PCB)
CON1
LEFT IN
BAL
E
LEFT IN
UNBAL
D4
100nF
100nF D8
S1d
IC9
5532
68Ω
C1
820Ω
IC8
5532
22pF
100nF
IC7
5532
10 µF
1
100nF
1 µFC 250V
2015PP
15150140
33Ω
RFC4
10 µF
820Ω
10 µF
1
1 µF 04105151
250V PP
S1c
100nF
820Ω
100nF
5102 C
100nF
100nF
1
820Ω
820Ω
10 µF
IC10
5532
1
1
820Ω
100nF
820Ω
22pF
820Ω
10 µF
IC11
5532
820Ω
22pF
10Ω
22pF
100nF D5
100nF D7
RANGE
820Ω
100nF
22pF
33Ω
33Ω
22p
100nF
100nF
100nF
820Ω
D6
D1
D3
S1
100nF
10Ω
330Ω
1k
3.0k
3.0k
3.0k
30k
30k
30k
68Ω
D2
120Ω
120Ω
LM337L
1k
CON5
RIGHT IN
UNBAL
RFC3
2
1
3
1M
1M
CON2
C1
-40dB
1k
C2
-40dB
C1
S1b
0dB
C2
RFC2
C2
100nF
S1a
470 µF
-2.5V
30k
30k
30k
3.0k
3.0k
3.0k
1k
V 5 1-
100nF
820Ω
100nF
68Ω
33Ω
22pF
10 µF
68Ω
30k
30k
30k
3.0k
3.0k
3.0k
22p
1
100nF
100nF
100nF
820Ω
1206
33Ω
33Ω
3
4
CON6
RIGHT
OUT
REG4
+
100nF
V0
C1
1
1 µF 250V PP
1M
1M
2
IC6
5532
1
1 µF 250V PP
RFC1
820Ω
10 µF
IC4
5532
IC3
5532
1
100nF
100nF
1
820Ω
10 µF
10 µF
820Ω
820Ω
820Ω
10 µF
IC1
5532
100nF
22pF
820Ω
820Ω
22pF
IC2
5532
820Ω
100nF
22pF
5
+2.5V
820Ω
V 531-
2
C2
LM317L
V 511 +
100nF
K
3.0k
3.0k
3.0k
30k
30k
30k
120Ω
120Ω
100nF
100nF
10Ω
10Ω
10 µF
REG3
POWER
A
CON7
+
+
22pF
470 µF
LED1
HTRAE S NIA M
1
10 µF
820Ω
S2
+
CON3
LEFT
OUT
+ 15V DC INPUT
–
BOX GND
820Ω
EARTH LIFT
CON4
E
RIGHT IN
BAL
Fig.5: follow this layout diagram to install the parts on the top of the PCB. A mixture of leaded (through-hole) and
SMD components is used, with some SMD parts also fitted to the underside of the board as shown on Fig.6. The only
component not mounted on the PCB is range selector switch S1, which mounts on the front panel. The photo below
shows the completed PCB.
siliconchip.com.au
May 2015 71
(UNDERSIDE OF PCB)
MAINS EARTH
7 NO C
9 CI
2355
0 1 CI
2355
1 1 CI
2355
100nF
10Ω
10Ω
22pF
820Ω
820Ω
IC5
5532
22pF
820Ω
22pF
NOTE:
ALL COMPONENTS FITTED ON
THE UNDERSIDE OF THE PCB
ARE IN THESE TWO AREAS ONLY
820Ω
820Ω
7 CI
2355
V 5. 2 +
-15V
10 µF
100nF
22pF
0V
22pF
22pF
3 GER
+15V
V 5. 2-
22pF
10Ω
100nF
10Ω
820Ω
IC12
5532
820Ω
-15V
3 NO C
6021
22pF
820Ω
4 GER
1
2S
1
6 NO C
10 µF
100nF
6 CI
2355
4 CI
2355
3 CI
2355
1 CI
2355
C 2015
PP5V100522 CFµ 1
04105151
1P5P1V5005124 0Fµ 1
PP V 0 5 2 Fµ 1
PP V 0 5 2 Fµ 1
3 CFR
1 CFR
4 CFR
1
3
2 CFR
1
2
1S
E
4 NO C
5 NO C
3
2
E
2 NO C
1 NO C
Fig.6: here’s how to install the SMD parts on the underside of the PCB. As shown, these parts are fitted to two areas
at the top left and top right of the diagram.
matching hole in the rear panel when
the unit is assembled into the case.
Step 6: wind the four EMI suppression
inductors (chokes). Each inductor is
wound on a 5mm-long, 4mm-OD ferrite bead, using 0.25mm enamelled
copper wire. All four inductors have
only two full turns but the winding
details vary.
RFC2 & RFC4 have only a single
2-turn winding. By contrast, RFC1 &
RFC3 have two turns wound in bifilar
fashion, ie, two short lengths of wire
are threaded through the bead together.
The ends of these wires are then cut
short (about 7mm long at each end)
and tinned, ready to be soldered to
the pads of the PCB.
Take care not to transpose the end
connections of the two wires passing
through RFC1 & RFC3, or you’ll get a
mysterious phase reversal!
The four inductors can now be fitted
to the PCB (just behind the positions
for CON1, CON2, CON4 & CON5).
Step 7: fit connectors CON1-CON7 to
the top of the PCB. Be sure to push
each one all the way down so that it
sits flush against the PCB before soldering its leads.
Step 8: fit earth lift switch S2 to the rear
of the PCB. This is a very small slider
switch but it’s no harder to solder in
place than the SMD components.
Step 9: fit a single PCB terminal pin
at the rear of the board, in the posi-
Table 1: Resistor Colour Codes
o
o
o
o
o
o
o
o
o
No.
4
12
12
4
1
4
4
6
72 Silicon Chip
Value
1MΩ
30kΩ
3.0kΩ
1kΩ
330Ω
120Ω
68Ω
33Ω
4-Band Code (1%)
brown black green brown
orange black orange brown
orange black red brown
brown black red brown
orange orange brown brown
brown red brown brown
blue grey black brown
orange orange black brown
tion labelled BOX GND in Fig.5 (just
between S2 and CON7).
Step 10: complete the PCB assembly
by fitting four 4-pin SIL headers in the
positions indicated in the front centre
of the PCB, grouped around diodes
D1-D8 and their bypass capacitors.
These headers will be used to make
the connections to the four sections
of range selector switch S1.
Preparing switch S1
The PCB assembly can now be put
Table 2: Capacitor Codes
Value µF Value IEC Code EIA Code
1µF
1µF
1u0
105
22pF NA
22p
22
5-Band Code (1%)
brown black black yellow brown
orange black black red brown
orange black black brown brown
brown black black brown brown
orange orange black black brown
brown red black black brown
blue grey black gold brown
orange orange black gold brown
siliconchip.com.au
Fig.6: the underside of the PCB carries op amps IC5 & IC12 and their associated SMD parts. Be sure to orientate the
op amps correctly and use solder wick to clean up any solder bridges between their pins.
aside while you prepare switch S1,
as follows:
Step 1: cut its control spindle to about
12mm long, then smooth off any burrs
using a small file.
Step 2: cut a piece of 4-wire rainbow
ribbon cable into four 35mm lengths
and strip 5mm of insulation from both
ends of all four wires. Carefully tin the
ends of all wires, using a minimum of
heat and solder.
Step 3: solder one end of each wire
in each 4-wire cable to one section of
switch S1. The first wire is soldered
to the inner rotor lug, while the other
three wires are soldered to the outer
contact lugs as shown in the accompanying photo. Note that in each group
the second wire connects to the “most
clockwise” contact lug (looking from
the front), the third wire to the centre
contact lug and the fourth wire to the
“most anticlockwise” contact lug.
Step 4: solder the other ends of the
ribbon cable wires to the connection
lugs of four 4-way SIL sockets (again
as shown in the photo). Note that in
each case, the wire from the switch
siliconchip.com.au
This close-up of the rear of range switch S1 shows how the four short ribbon
cables are attached to its connection lugs and also to the four small SIL female
header sections used to connect to the PCB.
May 2015 73
Above: switch S1 is mounted on the front panel, while the four SIL sockets at the ends of its ribbon cables are plugged
into matching pin headers on the PCB (see text for details on socket orientation). Note: this photo shows the original
metal front panel supplied with the case, whereas the final version uses a PCB front panel and a PCB rear panel. Both the
front and rear panel PCBs are available from the SILICON CHIP Online Shop.
rotor connects to one end lug of the
SIL socket, with the other three wires
soldered to the remaining lugs of the
socket in the same order as before. This
should be clear if you look closely at
the photo.
Alternatively, if you can obtain
4-way cables with “DuPont” connectors already fitted, you can save yourself some effort. Just cut them to length
and solder them to the rotary switch.
Your range selector switch assembly
is now complete.
PCB front & rear panels
No case preparation is necessary
since pre-drilled PCBs with screened
lettering are used for the front and
rear panels. These take the place of
the panels supplied with the case. The
front-panel PCB is coded 04105152,
while the rear panel PCB is coded
0410515. Both boards measure 170 x
64mm and can be purchased from the
SILICON CHIP Online Shop.
Once you have the panels, the next
74 Silicon Chip
step is to fit the front panel PCB to the
main PCB. That’s done by first bringing
it down at an angle so that the notches
at the top of the XLR socket holes slip
down behind the PUSH levers on the
two sockets. At the same time, the two
13mm-diameter holes must be slipped
over the BNC sockets, after which the
panel is straightened and pushed all
the way up to the PCB, so that it fits
close to the four input sockets.
It’s then just a matter of securing
the panel in pace by fitting the nuts
that come with the BNC sockets and
by installing pairs of 6G x 6mm selftapping screws through the 3mm holes
adjacent to each XLR socket.
Range selector switch S1 can now be
attached to the front panel PCB. That’s
done by first removing its mounting
nut and checking to make sure that its
locating spigot is set correctly to give
three positions. The switch is then fed
through its mounting hole and secured
by doing up its mounting nut to hold
it firmly in position.
S1’s knob can then be fitted to its
spindle and its grub screw tightened
firmly.
Once the switch is in place, connect
the four SIL sockets to their matching
pin headers on the PCB. The “rotor
wire” end of each socket goes to the
header end labelled S1a, S1b, S1c
or S1d.
As shown on Fig.5, these labels are
at the rearmost ends of the headers for
S1b & S1c, while they are at the far left
and far right of the headers for S1a &
S1d. It’s important to get these socket/
header connections correct, otherwise
you’ll get some very strange results.
Final assembly
Now for the final assembly – fitting
the front-panel/PCB assembly into the
case. There are no mounting screws or
pillars, because the extruded case has
a series of horizontal PCB mounting
slots running along each inside end.
The main PCB simply slips snugly
into the lowest slot at each end, until
siliconchip.com.au
The left and right channel BNC output sockets, the earth lift switch and the green power LED protrude through matching
holes in the rear panel. Access is also provided through the rear panel to the 5-pin DIN power supply socket.
the front panel PCB meets the case.
The back of the main PCB will then
be only about 1mm in from the rear
of the case, so that the power socket
is accessible when the rear panel PCB
is later fitted in place.
Once the PCB assembly has been
slid into place, secure it using five of
the supplied M3 x 12mm socket-head
screws (these go through the holes
in the front panel). However, before
fitting the screw into the lower frontcentre hole, it’s a good idea to fit a thin
M3 star lockwasher between the panel
and the case. This is to make sure that
there’s a good electrical connection
between the case and the front panel
PCB earth pattern when the screw is
tightened up.
The rear panel PCB is attached to
the rear of the case using the five remaining M3 x 12mm screws but before
doing this, there are two small jobs to
do. The first is to fasten a small solder
lug to the inside of this PCB, using an
M3 x 6mm machine screw, M3 nut
and star lockwasher. This screw passes
through the 3mm hole in the rear panel
PCB just to the right of the 15mm
diameter power input hole in the
centre (and just above the rectangular
hole for the earth lift switch actuator).
Fit the star lockwasher over the
screw before fitting the solder lug and
the nut. This will ensure a good electrical connection between the solder lug
and the rear panel PCB earth pattern
when the assembly is tightened up.
That done, cut a short length (say
50mm) of insulated hook-up wire, strip
siliconchip.com.au
Resistors & Thermal Noise
Back in 1926, John Johnson of Bell Labs in the USA discovered that electrical
noise was generated in all electrical conductors at temperatures above absolute zero
(0K = -273°C), due to thermal agitation of the charge carriers (eg, the electrons).
This happens regardless of whether the conductor concerned has any voltage applied to it or is conducting any current. It is basically determined by the resistance
of the conductor and the temperature, although the bandwidth of measurement
also plays a role in terms of the actual noise voltage.
Johnson’s Bell Labs colleague Harry Nyquist worked out how this noise is generated and came up with a number of expressions which allow its power density
and/or RMS voltage level over a given bandwidth to be calculated.
The most useful of these expressions is the one to calculate RMS noise voltage
for a given measurement bandwidth:
Vn = √(4.kB.T.R.∆f)
where kB is Boltzmann’s constant in Joules per Kelvin (1.38 x 10-23), T is the
temperature in Kelvins (°C + 273), R is the resistance in ohms and ∆f is the measurement bandwidth in Hertz.
For example, a 1kΩ resistor at 25°C (= 298K) will generate an RMS thermal
noise voltage of 0.5876µV (ie, 587.6nV or -124.618dBV), when measured over a
bandwidth of 20,980Hz (20Hz – 21.0kHz).
Note that thermal or Johnson (or Johnson/Nyquist) noise is quite different from
Shot noise, which is the additional noise generated in a conductor when a voltage
is applied and a current begins to flow through it.
Thermal noise also has nothing to do with the actual conducting material inside
a resistor or other component – it’s purely to do with the resistance and the temperature. So if you have two 1kΩ resistors, one with a metal film element and the
other with a carbon composition element, they will both generate the same thermal
noise at 298K when measured over the same bandwidth.
about 5mm of insulation from each end
and tin the wires. One end of this wire
is then soldered to the solder lug on the
inside of the rear panel, while the other
end is soldered to the PCB terminal pin
at the rear of the PCB (between CON7
and earth lift switch S2).
The second small job is to bend
LED1’s lead down by 90° (so that it
faces outwards) at a point about 10mm
up from the PCB. This will ensure that
the LED’s body will line up with its
matching hole in the rear panel PCB
and protrude slightly through it when
May 2015 75
Parts List
1 aluminium instrument case,
170 x 85 x 54mm (W x D x H)
(Box Enclosures B4-080SI,
element14 code 930-7443)
1 double-sided plated-through
PCB, code 04105151, 160 x
80mm
1 front panel PCB, code 04105152,
170 x 64mm
1 rear panel PCB, code 04105153,
170 x 64mm
1 ±15V DC power supply assembly
plus 17VAC earthed plugpack
(Jaycar MP3022) (see text)
4 ferrite beads, 4mm OD x 5mm
long
1 200mm length of 0.25mm
enamelled copper wire (for
winding RFC1-RFC4)
1 4-pole 3-position rotary switch
(S1)
1 instrument knob, 20mm diameter with grub-screw
1 subminiature SPDT slide
switch, PCB mounting with
side actuator (S2) (element14
code 120-1431)
2 3-pin XLR compact female
sockets, 90° PCB-mount
(CON1, CON4) (Altronics P0875)
the rear panel is fitted.
Once that’s been done, position the
earth lead so that it won’t get damaged, then fit the real panel. Make sure
that LED1 and S2 pass through their
matching holes in the panel, then fit
the mounting nuts to CON3 and CON6
and the five remaining case assembly
screws.
Another lockwasher
As with the front panel, it’s a good
idea to fit a thin M3 star lockwasher
between the rear panel and the lower
4 BNC sockets, 90° PCB-mount
(CON2,CON3,CON5 & CON6)
1 5-pin DIN socket, 90° PCBmount (CON7)
1 5-pin DIN line plug
1 1m length 4-core shielded
cable
4 4-pin SIL header strips
4 4-pin SIL female headers
4 35mm lengths of 4-wire ribbon
cable or 2 x 4-way cables with
DuPont header plugs at each
end (these also replace the SIL
female headers)
4 6G x 6mm self-tapping screws
1 M3 x 6mm machine screw
1 solder lug
1 M3 star lockwasher
2 thin M3 star lockwashers
1 M3 nut
1 PCB terminal pin, 1mm diameter
1 50mm length of insulated hookup wire
4 adhesive rubber feet
Semiconductors
12 NE5532D dual low-noise op
amps, SOIC-8 SMD package
(IC1-IC12) (element14 code
958-9856)
centre of the case, before you fit the
lower centre screw. This is again to ensure that there will be a good electrical
connection, this time between the rear
panel and the case once that screw is
tightened. It also means that, the case
(and both the front and rear panels)
will be reliably connected to mains
earth for shielding when the Balanced
Input Attenuator is connected to the
Universal Regulator Mk2.
Your Balanced Input Attenuator
is now assembled and ready for use.
However, it’s a good idea to fit four
1 LM317L adjustable regulator,
TO-92 (REG3)
1 LM337L adjustable regulator,
TO-92 (REG4)
1 3mm green LED (LED1)
8 1N5711W-7-F Schottky diode,
SOD-123 SMD package (D1-D8)
(element14 code 185-8640)
Capacitors
2 470µF 16V RB electrolytic
2 10µF 16V RB electrolytic
12 10µF 35V MLCC, SMD 1210,
X7R dielectric
4 1µF 250V polypropylene 5%
32 100nF 50V MLCC, SMD 1206,
X7R dielectric
2 100nF multilayer ceramic
4 22pF 100V disc ceramic, NP0
16 22pF 50V ceramic, SMD
1206, C0G/NP0 dielectric
Resistors (1% tolerance)
4 1MΩ 0.5W metal film
12 30kΩ 0.5W metal film (0.1%)
12 3.0kΩ 0.5W metal film (0.1%)
4 1kΩ 0.5W metal film (0.1%)
32 820Ω 1/8W, SMD 1206 (0.1%)
1 330Ω 0.5W metal film
4 120Ω 0.5W metal film
4 68Ω 0.5W metal film
6 33Ω 0.5W metal film
8 10Ω 1/8W, SMD 1206
adhesive rubber feet to the underside
of the case, so that it can be placed on
top of the QA400 Analyser or another
instrument without scratching it.
All that remains is to wire up the
power cable, using the diagram at the
bottom of Fig.4 as a guide. This will
allow you to connect the unit to the
Universal Regulator Mk2 (Version
C). Once you’ve done this, plug the
17VAC plugpack into a power outlet
and check that LED1 on the rear of the
attenuator lights, to show that it has
SC
powered up correctly.
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76 Silicon Chip
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