This is only a preview of the October 2022 issue of Silicon Chip. You can view 44 of the 112 pages in the full issue, including the advertisments. For full access, purchase the issue for $10.00 or subscribe for access to the latest issues. Articles in this series:
Items relevant to "30V 2A Bench Supply, Part 1":
Items relevant to "PIC & AVR Breakout Boards":
Items relevant to "Buck/Boost Battery Charging":
Items relevant to "Multi-Stage Buck/Boost Charger":
Items relevant to "Automatic Train Controller":
Items relevant to "WiFi Programmable DC Load, Part 2":
Purchase a printed copy of this issue for $11.50. |
PIC
and
AVR
Breakout Boards
By Tim Blythman
T
he three Breakout
Boards we designed are
intended to plug into a breadboard
while also connecting to a Snap or
PICkit 4 programmer for power and
programming.
Two can be used with the four PIC
parts we discussed in the feature article: one for SOIC parts and the other for
DIP. The circuit for these two boards
is identical – see Fig.3.
The other is designed for the
AVR64DD32 and its circuit is shown
in Fig.6. The PICkit 4 cannot provide
power in UPDI mode (as for newer
AVR chips), so we recommend using
a Snap modified to provide 5V with
the AVR64DD32.
PIC Breakout
These PIC Breakout Boards accept
SOIC (Fig.4) or DIP (Fig.5) devices up
to 20 pins and are designed to provide
basic programmer connections and the
two passive components needed for a
minimal working setup.
They break out each pin of the
microcontroller to an adjacent header
pin. This could be a standard header
below to plug into a breadboard, or a
header socket above, into which you
can plug jumper wires. We’ll describe
the parts needed to plug into a breadboard.
Many recent 8-bit PIC parts have
standard pinouts on their topmost
pins, shown as pins 1-4 and 17-20 in
Fig.1 (page 45). So this Breakout should
work for most recent 8-pin, 14-pin and
20-pin 8-bit PICs, as long as they are
placed at the top of the Breakout.
You could fit the DIP breakout with
a 20-pin narrow IC socket to allow
parts to be changed in and out. Alternatively, a narrow ZIF (zero insertion
force) socket could be used, turning
the Breakout Board into a handy programming jig.
Assembly of the PIC Breakout
During construction, refer to the
appropriate overlay diagram, Fig.4 or
Fig.5. Both are double-sided boards,
with the SOIC version being 15.5 ×
32.5mm and the DIP version being 15
× 35.5mm.
If you have the SMD version, start
by soldering the microcontroller in
place. If it is a 20-pin part, it will be
a tight fit, so keep it clear of the pads
for the header pins.
Apply flux and rest the chip in
place, ensuring that pin 1 goes to the
end near CON1. 8-pin and 14-pin parts
won’t be as fussy as they are narrower
but should have their pin 1 in the same
location.
Tack one lead and check that all the
remaining pins are aligned before soldering the others. Check there are no
bridges between pins or to the header
pin pads; if there are, clean them up
with flux, solder braid and a clean
iron. Then use an appropriate solvent
to remove any remaining flux.
If you have the DIP version, solder
the socket or IC in place. Like the SMD
part, you can tack one lead and then
check that the socket or IC is flat and
flush before soldering the other leads.
Next, solder the capacitor and resistor and trim their leads close to the
PCB.
To fit and align the header pins, it’s
a good idea to plug them into a breadboard first. This will guarantee that the
pins will align with the breadboard in
the future. Place the PCB over the pins
Fig.3: the 20-pin Breakout Board circuit connects the
programmer header (CON1) to the chip with all pins
also going to a pair of SIL headers.
Figs.4 & 5: the breakout boards have been designed
for breadboarding or general use (eg, plugging into
a pair of SIL sockets). They accept 8, 14 and 20-pin
devices with pin 1 in the same position.
50
Silicon Chip
Australia's electronics magazine
siliconchip.com.au
and push it down flat. Tack the corner
pins and adjust if necessary before soldering the remaining pins.
Finally, fit the right-angled header,
CON1.
Connect your programmer, being
sure to align the arrows that mark pin
1 on both the programmer and the
Breakout’s programming header.
AVR Breakout
The PCB overlay for the 16 ×
53.5mm AVR Breakout Board, coded
24110223, is shown in Fig.7. We’ve
made it as narrow as possible to conserve breadboard space, resulting in a
gap in the middle of the rows of pins.
It therefore has 16 pins down each
side, but they take up 20 rows on a
breadboard.
Since there are two main power rails
and the VDDIO2 pin for the MVIO feature, there are three bypass capacitors.
The jumper shunt connects the two
rails, which is necessary for applications that don’t use MVIO.
The 1kW resistor on this board is
connected between VDD and UPDI.
This is discussed in the accompanying article and is necessary if you are
using a Snap programmer.
Assembling the AVR Breakout
The pitch of the TQFP AVR64DD32
chips is finer than SOIC parts, but still
Parts List – PIC Breakout Board
1 double-sided PCB coded 24110225, 15.5 × 32.5mm (for SOIC parts) OR
1 double-sided PCB coded 24110222 15 × 35.5mm (for DIP parts)
1 8/14/20 pin PIC16F18xxx microcontroller in SOIC/DIP package
1 20-pin DIL IC socket (optional; for DIP micros)
2 10-way pin headers, 2.54mm pitch
1 5-way right-angle pin header, 2.54mm pitch (CON1)
1 100nF MKT or ceramic capacitor
1 10kW axial 1/4W resistor
Parts List – AVR64DD32 Breakout board
1 double-sided PCB coded 24110223, 16 × 53.5mm
4 8-pin headers, 2.54mm pitch
1 4-way right-angle male header, 2.54mm pitch (CON1)
1 2-way header and jumper shunt, 2.54mm pitch (JP1)
3 100nF MKT or ceramic capacitors
1 1kW axial 1/4W resistor
1 AVR64DD32-I/PT 8-bit microcontroller, TQFP-32 (7×7mm) (IC1)
not too difficult to solder. Apply flux
and rest the part roughly in place,
ensuring pin 1 is in the correct location, then tack one lead. Take care to
check that all four sides are aligned
before tacking another pin on an
opposite corner, then soldering all the
remaining leads.
Remember that you can use flux,
solder wicking braid and a clean iron
to remove any bridges.
Fit the three capacitors next and
follow with the 1kW resistor if that
is needed. JP1 can be installed next.
You should leave the jumper shunt in
place unless you plan to connect an
alternative VDDIO2 supply and activate MVIO.
Like the DIP PIC Breakout, you can
align the header pins by pushing them
into a breadboard first. Leave a gap of
four rows in the middle, then push
the PCB down firmly before soldering the pins.
Finally, fit the four-way header
(CON1) for the programmer and attach
the programmer. The arrow marks pin
1 and the programmer should have a
corresponding mark.
MPLAB X
If you haven’t used the MPLAB
X IDE before, see our feature in the
January 2021 issue (siliconchip.au/
Article/14707). If you need to manually install the DFP (device family
pack) for the AVR64DD32 or any of
the PIC parts, use the Tools → Packs
SC
menu item.
Fig.6: The AVR64DD32
Breakout Board is
similar but brings the
pins out to four headers
as the chip has pins on
four sides.
Fig.7: the four headers
are arranged in two
rows so they can
be plugged into a
breadboard. The gaps
mean the board is
narrow enough for a
standard breadboard.
siliconchip.com.au
Australia's electronics magazine
October 2022 51
|